J721E common processor board has an onboard mux for selecting whether
the OSPI signals are externally routed to OSPI flash or Hyperflash. The
mux state signal input is tied to WKUP_GPIO0_8 and is used by bootloader
for enabling the corresponding node accordingly. Add pinmux for the same.
Signed-off-by: Vaishnav Achath <vaishnav.a@ti.com>
Link: https://lore.kernel.org/r/20230513123313.11462-5-vaishnav.a@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
J7200 common processor board has an onboard mux for selecting whether
the OSPI signals are externally routed to OSPI flash or Hyperflash. The
mux state signal input is tied to WKUP_GPIO0_6 and is used by bootloader
for enabling the corresponding node accordingly. Add pinmux for the same.
Signed-off-by: Vaishnav Achath <vaishnav.a@ti.com>
Link: https://lore.kernel.org/r/20230513123313.11462-4-vaishnav.a@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
J721E SoM has a HyperFlash and HyperRam connected to HyperBus memory
controller, add corresponding node, pinmux and partitions for the same.
HyperBus is muxed with OSPI and only one controller can be active at a
time, therefore keep HyperBus node disabled. Bootloader will detect the
external mux state through a wkup gpio and enable the node as required.
Signed-off-by: Vaishnav Achath <vaishnav.a@ti.com>
Link: https://lore.kernel.org/r/20230513123313.11462-3-vaishnav.a@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
J721E has a Flash SubSystem that has one OSPI and one HyperBus with
muxed datapath and another independent OSPI. Add DT nodes for HyperBus
controller and keep it disabled and model the data path selection mux as a
reg-mux.
Signed-off-by: Vaishnav Achath <vaishnav.a@ti.com>
Link: https://lore.kernel.org/r/20230513123313.11462-2-vaishnav.a@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
MDIO nodes defined in the top-level J721e SoC dtsi files are incomplete
and will not be functional unless they are extended with a pinmux.
As the attached PHY is only known about at the board integration level,
these nodes should only be enabled when provided with this information.
Disable the MDIO nodes in the dtsi files and only enable the ones that
are actually pinned out on a given board.
Signed-off-by: Andrew Davis <afd@ti.com>
Link: https://lore.kernel.org/r/20230515172137.474626-5-afd@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Mailbox nodes defined in the top-level AM64x SoC dtsi files are incomplete
and may not be functional unless they are extended with a chosen interrupt
and connection to a remote processor.
As the remote processors depend on memory nodes which are only known at
the board integration level, these nodes should only be enabled when
provided with the above information.
Disable the Mailbox nodes in the dtsi files and only enable the ones that
are actually used on a given board.
Signed-off-by: Andrew Davis <afd@ti.com>
Link: https://lore.kernel.org/r/20230515172137.474626-4-afd@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
PCIe nodes defined in the top-level J721e SoC dtsi files are incomplete
and will not be functional unless they are extended with a SerDes PHY.
And usually only one of the two modes can be used at a time as they
share a SerDes link.
As the PHY and mode is only known at the board integration level, these
nodes should only be enabled when provided with this information.
Disable the PCIe nodes in the dtsi files and only enable the ones that
are actually pinned out on a given board.
Signed-off-by: Andrew Davis <afd@ti.com>
Link: https://lore.kernel.org/r/20230515172137.474626-3-afd@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
These nodes are example nodes for the PCIe controller in "endpoint" mode.
By default the controller is in "root complex" mode and there is already a
DT node for the same.
Examples should go in the bindings or other documentation.
Remove this node.
Signed-off-by: Andrew Davis <afd@ti.com>
Link: https://lore.kernel.org/r/20230515172137.474626-2-afd@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Mailbox nodes are now disabled by default. The BeagleBoard AI64 DT
addition went in at around the same time and must have missed that
change so the mailboxes are not re-enabled. Do that here.
Fixes: fae14a1cb8 ("arm64: dts: ti: Add k3-j721e-beagleboneai64")
Signed-off-by: Andrew Davis <afd@ti.com>
Reviewed-by: Nishanth Menon <nm@ti.com>
Link: https://lore.kernel.org/r/20230515172137.474626-1-afd@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
The OLDI-LCD1EVM add on board has Rocktech RK101II01D-CT panel[1] with
integrated touch screen. The integrated touch screen is Goodix GT928.
This panel connects with AM65 GP-EVM[2].
Add DT nodes for these and connect the endpoint nodes with DSS.
[1]: Panel link
https://www.digimax.it/en/tft-lcd/20881-RK101II01D-CT
[2]: AM654 LCD EVM:
https://www.ti.com/tool/TMDSLCD1EVM
Signed-off-by: Jyri Sarha <jsarha@ti.com>
Signed-off-by: Nikhil Devshatwar <nikhil.nd@ti.com>
[abhatia1@ti.com: Make cosmetic and 6.4 kernel DTSO syntax changes]
Signed-off-by: Aradhya Bhatia <a-bhatia1@ti.com>
Reviewed-by: Tomi Valkeinen <tomi.valkeinen@ideasonboard.com>
Reviewed-by: Andrew Davis <afd@ti.com>
Link: https://lore.kernel.org/r/20230509102354.10116-2-a-bhatia1@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
The am62ax supports a single Voltage and Thermal Management (VTM) device
located in the wakeup domain with three associated temperature monitors
located in various hot spots of the die.
Signed-off-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20230405215328.3755561-4-bb@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
The am62x supports a single Voltage and Thermal Management (VTM) module
located in the wakeup domain with two associated temperature monitors
located in hot spots of the die.
Signed-off-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20230405215328.3755561-3-bb@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
The board uses lane 1 of SERDES for USB. Set the mux
accordingly.
The USB controller and EVM supports super-speed for USB0
on the Type-C port. However, the SERDES has a limitation
that up to 2 protocols can be used at a time. The SERDES is
wired for PCIe, eDP and USB super-speed. It has been
chosen to use PCIe and eDP as default. So restrict
USB0 to high-speed mode.
Signed-off-by: Aswath Govindraju <a-govindraju@ti.com>
Signed-off-by: Matt Ranostay <mranostay@ti.com>
Signed-off-by: Ravi Gunasekaran <r-gunasekaran@ti.com>
Reviewed-by: Roger Quadros <rogerq@kernel.org>
Link: https://lore.kernel.org/r/20230331090028.8373-6-r-gunasekaran@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Reserve memory for remote processors. Two memory regions are reserved
for each remote processor. The first 1Mb region is used for virtio
Vring buffers for IPC and the second region is used for holding
resource table, trace buffer and as external memory to the remote
processor. The mailboxes are also assigned for each remote processor.
Signed-off-by: Hari Nagalla <hnagalla@ti.com>
Link: https://lore.kernel.org/r/20230502231527.25879-4-hnagalla@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
The J784S4 SoCs have four TMS320C71x DSP subsystems in the MAIN voltage
domain. The functionality of these DSP subsystems is similar to the C71x
DSP subsystems on earlier k3 device J721S2. Each subsystem has a 48 KB of
L1D configurable SRAM/Cache and 512 KB of L2 SRAM/Cache. This subsystem
has a CMMU but is not currently used. The inter-processor communication
between the main A72 cores and the C71x DSPs is achieved through shared
memory and mailboxes. Add the DT nodes for these DSP processor sub-systems.
Signed-off-by: Hari Nagalla <hnagalla@ti.com>
Link: https://lore.kernel.org/r/20230502231527.25879-3-hnagalla@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
The J784S4 SoCs have 4 dual-core Arm Cortex-R5F processor (R5FSS)
subsystems/clusters. One R5F cluster (MCU_R5FSS0) is present within
the MCU domain, and the remaining three clusters are present in the
MAIN domain (MAIN_R5FSS0, MAIN_R5FSS1 & MAIN_R5FSS2). The functionality
of the R5FSS is same as the R5FSS functionality on earlier K3 platform
device J721S2. Each of the R5FSS can be configured at boot time to be
either run in a LockStep mode or in an Asymmetric Multi Processing (AMP)
fashion in Split-mode. These subsystems have 64 KB each Tightly-Coupled
Memory (TCM) internal memories for each core split between two banks -
ATCM and BTCM (further interleaved into two banks). There are some IP
integration differences from standard Arm R5 clusters such as the absence
of an ACP port, presence of an additional TI-specific Region Address
Translater (RAT) module for translating 32-bit CPU addresses into
larger system bus addresses etc.
Add the DT nodes for the R5F cluster/subsystems, the two R5F cores are
each added as child nodes to the corresponding cluster node. The clusters
are configured to run in LockStep mode by default, with the ATCMs enabled
to allow the R5 cores to execute code from DDR with boot-strapping code
from ATCM. The inter-processor communication between the main A72 cores
and these processors is achieved through shared memory and Mailboxes.
The following firmware names are used by default for these cores, and
can be overridden in a board dts file if needed:
MAIN R5FSS0 Core0: j784s4-main-r5f0_0-fw (both in LockStep and Split modes)
MAIN R5FSS0 Core1: j784s4-main-r5f0_1-fw (needed only in Split mode)
MAIN R5FSS1 Core0: j784s4-main-r5f1_0-fw (both in LockStep and Split modes)
MAIN R5FSS1 Core1: j784s4-main-r5f1_1-fw (needed only in Split mode)
MAIN R5FSS2 Core0: j784s4-main-r5f2_0-fw (both in LockStep and Split modes)
MAIN R5FSS2 Core1: j784s4-main-r5f2_1-fw (needed only in Split mode)
MCU R5FSS0 Core0: j784s4-mcu-r5f0_0-fw (needed only in Split mode)
MCU R5FSS0 Core1: j784s4-mcu-r5f0_1-fw (needed only in Split mode)
Signed-off-by: Hari Nagalla <hnagalla@ti.com>
Link: https://lore.kernel.org/r/20230502231527.25879-2-hnagalla@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
wkup_uart and main_uart1 on this platform is used by tifs and DM
firmwares. Describe them for completeness including the pinmux.
Signed-off-by: Nishanth Menon <nm@ti.com>
[bb@ti.com: updated pinmux and commit subject]
Signed-off-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20230425221708.549675-1-bb@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
iot boards have always defined their own aliases and with the base-board
defining it's own aliases, there are no pending boards depending on
common aliases defined in SoC level.
aliases are meant to be defined appropriately based on the exposed
interfaces at a board level, drop the aliases defined at SoC level.
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Kamlesh Gurudasani <kamlesh@ti.com>
Link: https://lore.kernel.org/r/20230419225913.663448-8-nm@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
