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While the CPUs thermal is handled by the LMH, and GPU has a passive cooldowm via the HLOS DCVS, all the other thermal blocks only have hot and critical and no passive/active trip points. Passive or active thermal management for those blocks should be either defined if somehow we can express those in DT or in the board definition if there's an active cooling device available. The tsens MAX_THRESHOLD is set to 120C on those platforms, so set the hot to 110C to leave a chance to HLOS to react and critical to 115C to avoid the monitor thermal shutdown. In the case a passive or active cooling device would be available, the downstream reference implementation uses the 95C "tj" trip point, as we already use for the gpuss thermal blocks. Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org> Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com> Link: https://lore.kernel.org/r/20250203-topic-sm8650-thermal-cpu-idle-v4-3-65e35f307301@linaro.org Signed-off-by: Bjorn Andersson <andersson@kernel.org>
Linux kernel
============
There are several guides for kernel developers and users. These guides can
be rendered in a number of formats, like HTML and PDF. Please read
Documentation/admin-guide/README.rst first.
In order to build the documentation, use ``make htmldocs`` or
``make pdfdocs``. The formatted documentation can also be read online at:
https://www.kernel.org/doc/html/latest/
There are various text files in the Documentation/ subdirectory,
several of them using the reStructuredText markup notation.
Please read the Documentation/process/changes.rst file, as it contains the
requirements for building and running the kernel, and information about
the problems which may result by upgrading your kernel.