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JESD216 mentions die erase, but does not provide an opcode for it. Check BFPT dword 11, bits 30:24, "Chip Erase, Typical time", it says: "Typical time to erase one chip (die). User must poll device busy to determine if the operation has completed. For a device consisting of multiple dies, that are individually accessed, the time is for each die to which a chip erase command is applied." So when a flash consists of a single die, this is the erase time for the full chip (die) erase, and when it consists of multiple dies, it's the die erase time. Chip and die are the same thing. Add support for die erase. For now, benefit of the die erase when addr and len are aligned with die size. This could be improved however for the uniform and non-uniform erases cases to use the die erase when possible. For example if one requests that an erase of a 2 die device starting from the last 64KB of the first die to the end of the flash size, we could use just 2 commands, a 64KB erase and a die erase. This improvement is left as an exercise for the reader. Tested-by: Fabio Estevam <festevam@denx.de> Link: https://lore.kernel.org/r/20231125123529.55686-2-tudor.ambarus@linaro.org Signed-off-by: Tudor Ambarus <tudor.ambarus@linaro.org>
Linux kernel
============
There are several guides for kernel developers and users. These guides can
be rendered in a number of formats, like HTML and PDF. Please read
Documentation/admin-guide/README.rst first.
In order to build the documentation, use ``make htmldocs`` or
``make pdfdocs``. The formatted documentation can also be read online at:
https://www.kernel.org/doc/html/latest/
There are various text files in the Documentation/ subdirectory,
several of them using the Restructured Text markup notation.
Please read the Documentation/process/changes.rst file, as it contains the
requirements for building and running the kernel, and information about
the problems which may result by upgrading your kernel.