When the temperature is below the first activation trip point the cooling
devices are not checked, so they cannot maintain fresh statistics. It
leads into the situation, when temperature crosses first trip point, the
statistics are stale and show state for very long period. This has impact
on IPA algorithm calculation and wrong decisions. Thus, check the cooling
devices even when the temperature is low, to refresh these statistics.
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210422114308.29684-3-lukasz.luba@arm.com
thermal_notify_framework just updates for a single trip point where as
thermal_zone_device_update does other bookkeeping like updating the
temperature of the thermal zone and setting the next trip point. The only
driver that was using thermal_notify_framework was updated in the previous
patch to use thermal_zone_device_update instead. Since there are no users
for thermal_notify_framework remove it.
Signed-off-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210122023406.3500424-3-thara.gopinath@linaro.org
On Intel processors, the core frequency can be reduced below OS request,
when the current temperature reaches the TCC (Thermal Control Circuit)
activation temperature.
The default TCC activation temperature is specified by
MSR_IA32_TEMPERATURE_TARGET. However, it can be adjusted by specifying an
offset in degrees C, using the TCC Offset bits in the same MSR register.
This patch introduces a cooling devices driver that utilizes the TCC
Offset feature. The bigger the current cooling state is, the lower the
effective TCC activation temperature is, so that the processors can be
throttled earlier before system critical overheats.
Note that, on different platforms, the behavior might be different on
how fast the setting takes effect, and how much the CPU frequency is
reduced.
This patch has been tested on a KabyLake mobile platform from me, and also
on a CometLake platform from Doug.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested by: Doug Smythies <dsmythies@telus.net>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210412125901.12549-1-rui.zhang@intel.com
Slab OOB issue is scanned by KASAN in cpu_power_to_freq().
If power is limited below the power of OPP0 in EM table,
it will cause slab out-of-bound issue with negative array
index.
Return the lowest frequency if limited power cannot found
a suitable OPP in EM table to fix this issue.
Backtrace:
[<ffffffd02d2a37f0>] die+0x104/0x5ac
[<ffffffd02d2a5630>] bug_handler+0x64/0xd0
[<ffffffd02d288ce4>] brk_handler+0x160/0x258
[<ffffffd02d281e5c>] do_debug_exception+0x248/0x3f0
[<ffffffd02d284488>] el1_dbg+0x14/0xbc
[<ffffffd02d75d1d4>] __kasan_report+0x1dc/0x1e0
[<ffffffd02d75c2e0>] kasan_report+0x10/0x20
[<ffffffd02d75def8>] __asan_report_load8_noabort+0x18/0x28
[<ffffffd02e6fce5c>] cpufreq_power2state+0x180/0x43c
[<ffffffd02e6ead80>] power_actor_set_power+0x114/0x1d4
[<ffffffd02e6fac24>] allocate_power+0xaec/0xde0
[<ffffffd02e6f9f80>] power_allocator_throttle+0x3ec/0x5a4
[<ffffffd02e6ea888>] handle_thermal_trip+0x160/0x294
[<ffffffd02e6edd08>] thermal_zone_device_check+0xe4/0x154
[<ffffffd02d351cb4>] process_one_work+0x5e4/0xe28
[<ffffffd02d352f44>] worker_thread+0xa4c/0xfac
[<ffffffd02d360124>] kthread+0x33c/0x358
[<ffffffd02d289940>] ret_from_fork+0xc/0x18
Fixes: 371a3bc79c ("thermal/drivers/cpufreq_cooling: Fix wrong frequency converted from power")
Signed-off-by: brian-sy yang <brian-sy.yang@mediatek.com>
Signed-off-by: Michael Kao <michael.kao@mediatek.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Cc: stable@vger.kernel.org #v5.7
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201229050831.19493-1-michael.kao@mediatek.com
When the function successfully finishes it logs an information about
the registration of the cooling device and use its name to build the
message. Unfortunately it was freed right before:
drivers/thermal/cpuidle_cooling.c:218 __cpuidle_cooling_register()
warn: 'name' was already freed.
Fix this by freeing after the message happened.
Fixes: 6fd1b186d9 ("thermal/drivers/cpuidle_cooling: Use device name instead of auto-numbering")
Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20210319202522.891061-1-daniel.lezcano@linaro.org
The division is used directly in re-divvying up power, the decimal part will
be discarded, devices will get less than the extra_actor_power - 1.
if using round the division to make the calculation more accurate.
For example:
actor0 received more than its max_power, it has the extra_power 759
actor1 received less than its max_power, it require extra_actor_power 395
actor2 received less than its max_power, it require extra_actor_power 365
actor1 and actor2 require the total capped_extra_power 760
using division in re-divvying up power
actor1 would actually get the extra_actor_power 394
actor2 would actually get the extra_actor_power 364
if using round the division in re-divvying up power
actor1 would actually get the extra_actor_power 394
actor2 would actually get the extra_actor_power 365
Signed-off-by: Jeson Gao <jeson.gao@unisoc.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1615796737-4688-1-git-send-email-gao.yunxiao6@gmail.com
Currently the naming of a cooling device is just a cooling technique
followed by a number. When there are multiple cooling devices using
the same technique, it is impossible to clearly identify the related
device as this one is just a number.
For instance:
thermal-idle-0
thermal-idle-1
thermal-idle-2
thermal-idle-3
etc ...
The 'thermal' prefix is redundant with the subsystem namespace. This
patch removes the 'thermal prefix and changes the number by the device
name. So the naming above becomes:
idle-cpu0
idle-cpu1
idle-cpu2
idle-cpu3
etc ...
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20210314111333.16551-4-daniel.lezcano@linaro.org
Currently the naming of a cooling device is just a cooling technique
followed by a number. When there are multiple cooling devices using
the same technique, it is impossible to clearly identify the related
device as this one is just a number.
For instance:
thermal-devfreq-0
thermal-devfreq-1
etc ...
The 'thermal' prefix is redundant with the subsystem namespace. This
patch removes the 'thermal' prefix and changes the number by the device
name. So the naming above becomes:
devfreq-5000000.gpu
devfreq-1d84000.ufshc
etc ...
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://lore.kernel.org/r/20210314111333.16551-3-daniel.lezcano@linaro.org
Currently the naming of a cooling device is just a cooling technique
followed by a number. When there are multiple cooling devices using
the same technique, it is impossible to clearly identify the related
device as this one is just a number.
For instance:
thermal-cpufreq-0
thermal-cpufreq-1
etc ...
The 'thermal' prefix is redundant with the subsystem namespace. This
patch removes the 'thermal' prefix and changes the number by the device
name. So the naming above becomes:
cpufreq-cpu0
cpufreq-cpu4
etc ...
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://lore.kernel.org/r/20210314111333.16551-2-daniel.lezcano@linaro.org
We want to have any kind of name for the cooling devices as we do no
longer want to rely on auto-numbering. Let's replace the cooling
device's fixed array by a char pointer to be allocated dynamically
when registering the cooling device, so we don't limit the length of
the name.
Rework the error path at the same time as we have to rollback the
allocations in case of error.
Tested with a dummy device having the name:
"Llanfairpwllgwyngyllgogerychwyrndrobwllllantysiliogogogoch"
A village on the island of Anglesey (Wales), known to have the longest
name in Europe.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Ido Schimmel <idosch@nvidia.com>
Link: https://lore.kernel.org/r/20210314111333.16551-1-daniel.lezcano@linaro.org
When adding support for V3U (r8a779a0) it was incorrectly recorded it
supports four nodes, while in fact it supports five. The fifth node is
named TSC0 and breaks the existing naming schema starting at 1. Work
around this by separately defining the reg property for V3U and others.
Restore the maximum number of nodes to three for other compatibles as
it was before erroneously increasing it for V3U.
Fixes: d7fdfb6541 ("dt-bindings: thermal: rcar-gen3-thermal: Add r8a779a0 support")
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210310110716.3297544-1-niklas.soderlund+renesas@ragnatech.se
