The board uses lane 3 of SERDES for USB. Set the mux
accordingly.
The USB controller and EVM supports super-speed for USB0
on the Type-C port. However, the SERDES has a limitation
that upto 2 protocols can be used at a time. The SERDES is
wired for PCIe, QSGMII and USB super-speed. It has been
chosen to use PCI2 and QSGMII as default. So restrict
USB0 to high-speed mode.
Signed-off-by: Roger Quadros <rogerq@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Vignesh Raghavendra <vigneshr@ti.com>
Link: https://lore.kernel.org/r/20200930122032.23481-7-rogerq@ti.com
First two lanes of SERDES is connected to PCIe, third lane is
connected to QSGMII and the last lane is connected to USB. However,
Cadence torrent SERDES doesn't support more than 2 protocols
at the same time. Configure it only for PCIe and QSGMII.
Signed-off-by: Kishon Vijay Abraham I <kishon@ti.com>
Signed-off-by: Roger Quadros <rogerq@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Vignesh Raghavendra <vigneshr@ti.com>
Link: https://lore.kernel.org/r/20200930122032.23481-6-rogerq@ti.com
J7200 SoM has a HyperFlash connected to HyperBus memory controller. But
HyperBus is muxed with OSPI, therefore keep HyperBus node disabled.
Bootloader will detect the mux and enable the node as required.
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Sekhar Nori <nsekhar@ti.com>
Link: https://lore.kernel.org/r/20200923163150.16973-3-vigneshr@ti.com
Add support for J7200 Common Processor Board.
The EVM architecture is very similar to J721E as follows:
+------------------------------------------------------+
| +-------------------------------------------+ |
| | | |
| | Add-on Card 1 Options | |
| | | |
| +-------------------------------------------+ |
| |
| |
| +-------------------+ |
| | | |
| | SOM | |
| +--------------+ | | |
| | | | | |
| | Add-on | +-------------------+ |
| | Card 2 | | Power Supply
| | Options | | |
| | | | |
| +--------------+ | <---
+------------------------------------------------------+
Common Processor Board
Common Processor board is the baseboard that has most of the actual
connectors, power supply etc. A SOM (System on Module) is plugged on
to the common processor board and this contains the SoC, PMIC, DDR and
basic high speed components necessary for functionality.
Note:
* The minimum configuration required to boot up the board is System On
Module(SOM) + Common Processor Board.
* Since there is just a single SOM and Common Processor Board, we are
maintaining common processor board as the base dts and SOM as the dtsi
that we include. In the future as more SOM's appear, we should move
common processor board as a dtsi and include configurations as dts.
* All daughter cards beyond the basic boards shall be maintained as
overlays.
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Signed-off-by: Peter Ujfalusi <peter.ujfalusi@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Grygorii Strashko <grygorii.strashko@ti.com>
Reviewed-by: Suman Anna <s-anna@ti.com>
Link: https://lore.kernel.org/r/20200914162231.2535-6-lokeshvutla@ti.com
The J7200 SoC is a part of the K3 Multicore SoC architecture platform.
It is targeted for automotive gateway, vehicle compute systems,
Vehicle-to-Vehicle (V2V) and Vehicle-to-Everything (V2X) applications.
The SoC aims to meet the complex processing needs of modern embedded
products.
Some highlights of this SoC are:
* Dual Cortex-A72s in a single cluster, two clusters of lockstep
capable dual Cortex-R5F MCUs and a Centralized Device Management and
Security Controller (DMSC).
* Configurable L3 Cache and IO-coherent architecture with high data
throughput capable distributed DMA architecture under NAVSS.
* Integrated Ethernet switch supporting up to a total of 4 external ports
in addition to legacy Ethernet switch of up to 2 ports.
* Upto 1 PCIe-GEN3 controller, 1 USB3.0 Dual-role device subsystems,
20 MCANs, 3 McASP, eMMC and SD, OSPI/HyperBus memory controller, I3C
and I2C, eCAP/eQEP, eHRPWM among other peripherals.
* One hardware accelerator block containing AES/DES/SHA/MD5 called SA2UL
management.
See J7200 Technical Reference Manual (SPRUIU1, June 2020)
for further details: https://www.ti.com/lit/pdf/spruiu1
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Grygorii Strashko <grygorii.strashko@ti.com>
Reviewed-by: Suman Anna <s-anna@ti.com>
Reviewed-by: Vignesh Raghavendra <vigneshr@ti.com>
Reviewed-by: Kishon Vijay Abraham I <kishon@ti.com>
Link: https://lore.kernel.org/r/20200914162231.2535-5-lokeshvutla@ti.com
The J7200 SoC is a part of the K3 Multicore SoC architecture platform.
It is targeted for automotive gateway, vehicle compute systems,
Vehicle-to-Vehicle (V2V) and Vehicle-to-Everything (V2X) applications.
The SoC aims to meet the complex processing needs of modern embedded
products.
Some highlights of this SoC are:
* Dual Cortex-A72s in a single cluster, two clusters of lockstep
capable dual Cortex-R5F MCUs and a Centralized Device Management and
Security Controller (DMSC).
* Configurable L3 Cache and IO-coherent architecture with high data
throughput capable distributed DMA architecture under NAVSS.
* Integrated Ethernet switch supporting up to a total of 4 external ports
in addition to legacy Ethernet switch of up to 2 ports.
* Upto 1 PCIe-GEN3 controller, 1 USB3.0 Dual-role device subsystems,
20 MCANs, 3 McASP, eMMC and SD, OSPI/HyperBus memory controller, I3C and
I2C, eCAP/eQEP, eHRPWM among other peripherals.
* One hardware accelerator block containing AES/DES/SHA/MD5 called SA2UL
management.
See J7200 Technical Reference Manual (SPRUIU1, June 2020)
for further details: https://www.ti.com/lit/pdf/spruiu1
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Grygorii Strashko <grygorii.strashko@ti.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Suman Anna <s-anna@ti.com>
Link: https://lore.kernel.org/r/20200914162231.2535-4-lokeshvutla@ti.com
Add PCIe device tree nodes (both RC and EP) for the four
PCIe instances here.
Also add the missing translations required in the "ranges"
DT property of cbass_main to access all the four PCIe
instances.
Signed-off-by: Kishon Vijay Abraham I <kishon@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Link: https://lore.kernel.org/r/20200914152115.1788-2-kishon@ti.com
We intend to use one header file for SERDES MUX for all
TI SoCs so rename the header file.
The exsting macros are too generic. Prefix them with SoC name.
While at that, add the missing configurations for completeness.
Fixes: b766e3b0d5 ("arm64: dts: ti: k3-j721e-main: Add system controller node and SERDES lane mux")
Reported-by: Peter Rosin <peda@axentia.se>
Signed-off-by: Roger Quadros <rogerq@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Acked-by: Peter Rosin <peda@axentia.se>
Link: https://lore.kernel.org/r/20200918165930.2031-1-rogerq@ti.com
Add a reserved memory node to reserve a portion of the DDR memory to be
used for performing inter-processor communication between all the remote
processors running RTOS on the TI J721E EVM boards. 28 MB of memory is
reserved for this purpose, and this accounts for all the vrings and vring
buffers between all the possible pairs of remote processors.
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Lokesh Vutla <lokeshvutla@ti.com>
Link: https://lore.kernel.org/r/20200825172145.13186-9-s-anna@ti.com
Two carveout reserved memory nodes have been added for the lone C71x DSP
remote processor device present within the MAIN voltage domain for the TI
J721E EVM boards. These nodes are assigned to the respective rproc device
node as well. The first region will be used as the DMA pool for the rproc
device, and the second region will furnish the static carveout regions for
the firmware memory.
The current carveout addresses and sizes are defined statically for each
device. The C71x DSP processor does support a MMU called CMMU, but is not
currently supported and as such requires the exact memory used by the
firmware to be set-aside. The firmware images currently do not need any
RSC_CARVEOUT entries either in their resource tables to allocate the
memory for firmware memory segments.
The reserved memory nodes can be disabled later on if there is no use-case
defined to use the C71x DSP remoteproc processor.
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Lokesh Vutla <lokeshvutla@ti.com>
Link: https://lore.kernel.org/r/20200825172145.13186-8-s-anna@ti.com
Add the required 'mboxes' property to the C71x DSP processor for the TI
J721E common processor board. The mailboxes and some shared memory are
required for running the Remote Processor Messaging (RPMsg) stack between
the host processor and each of the DSPs. The nodes are therefore added
in the common k3-j721e-som-p0.dtsi file so that all of these can be
co-located.
The chosen sub-mailboxes match the values used in the current firmware
images. This can be changed, if needed, as per the system integration
needs after making appropriate changes on the firmware side as well.
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Lokesh Vutla <lokeshvutla@ti.com>
Link: https://lore.kernel.org/r/20200825172145.13186-7-s-anna@ti.com
The J721E SoCs have a single TMS320C71x DSP Subsystem in the MAIN
voltage domain containing the next-generation C711 CPU core. The
subsystem has 32 KB of L1D configurable SRAM/Cache and 512 KB of
L2 configurable SRAM/Cache. This subsystem has a CMMU but is not
used currently. The inter-processor communication between the main
A72 cores and the C711 processor is achieved through shared memory
and a Mailbox. Add the DT node for this DSP processor sub-system
in the common k3-j721e-main.dtsi file.
The following firmware name is used by default for the C71x core,
and can be overridden in a board dts file if desired:
C71x_0 DSP: j7-c71_0-fw
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Lokesh Vutla <lokeshvutla@ti.com>
Link: https://lore.kernel.org/r/20200825172145.13186-6-s-anna@ti.com
Two carveout reserved memory nodes each have been added for each of the
C66x DSP remote processor devices present within the MAIN voltage domain
for the TI J721E EVM boards. These nodes are assigned to the respective
rproc device nodes as well. The first region will be used as the DMA pool
for the rproc devices, and the second region will furnish the static
carveout regions for the firmware memory.
The minimum granularity on the Cache settings on C66x DSP cores is 16 MB,
so the DMA memory regions are chosen such that they are in separate 16 MB
regions for each DSP, while reserving a total of 16 MB for each DSP and
not changing the overall DSP remoteproc carveouts.
The current carveout addresses and sizes are defined statically for each
device. The C66x DSP processors do not have an MMU, and as such require the
exact memory used by the firmwares to be set-aside. The firmware images
do not require any RSC_CARVEOUT entries in their resource tables to
allocate the memory for firmware memory segments.
The reserved memory nodes can be disabled later on if there is no use-case
defined to use the corresponding remote processor.
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Lokesh Vutla <lokeshvutla@ti.com>
Link: https://lore.kernel.org/r/20200825172145.13186-5-s-anna@ti.com
Add the required 'mboxes' property to both the C66x DSP processors for the
TI J721E common processor board. The mailboxes and some shared memory are
required for running the Remote Processor Messaging (RPMsg) stack between
the host processor and each of the DSPs. The nodes are therefore added
in the common k3-j721e-som-p0.dtsi file so that all of these can be
co-located.
The chosen sub-mailboxes match the values used in the current firmware
images. This can be changed, if needed, as per the system integration
needs after making appropriate changes on the firmware side as well.
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Lokesh Vutla <lokeshvutla@ti.com>
Link: https://lore.kernel.org/r/20200825172145.13186-4-s-anna@ti.com
The J721E SoCs have two TMS320C66x DSP Core Subsystems (C66x CorePacs)
in the MAIN voltage domain, each with a C66x Fixed/Floating-Point DSP
Core, and 32 KB of L1P & L1D configurable SRAMs/Cache and an additional
288 KB of L2 configurable SRAM/Cache. These subsystems do not have
an MMU but contain a Region Address Translator (RAT) sub-module for
translating 32-bit processor addresses into larger bus addresses.
The inter-processor communication between the main A72 cores and
these processors is achieved through shared memory and Mailboxes.
Add the DT nodes for these DSP processor sub-systems in the common
k3-j721e-main.dtsi file.
The following firmware names are used by default for these cores, and
can be overridden in a board dts file if desired:
C66x_0 DSP: j7-c66_0-fw
C66x_1 DSP: j7-c66_1-fw
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Lokesh Vutla <lokeshvutla@ti.com>
Link: https://lore.kernel.org/r/20200825172145.13186-3-s-anna@ti.com
The commit eb9f9173d0 ("arm64: dts: ti: k3-j721e-common-proc-board:
Add IPC sub-mailbox nodes") has added the sub-mailbox nodes used by
various remote processors and disabled the unused mailbox clusters
directly in the k3-j721e-common-proc-board dts file. Move all of these
nodes into the k3-j721e-som-p0.dtsi file instead to co-locate all the
mailboxes and the soon to be added DDR reserved-memory carveout nodes
used by remoteprocs within the same dtsi file.
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Lokesh Vutla <lokeshvutla@ti.com>
Link: https://lore.kernel.org/r/20200825172145.13186-2-s-anna@ti.com
The various CBASS interconnect nodes on K3 J721E SoCs are defined
using the node name "interconnect". This is not a valid node name
as per the dt-schema. Fix these node names to use the standard name
used for SoC interconnects, "bus".
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Lokesh Vutla <lokeshvutla@ti.com>
Link: https://lore.kernel.org/r/20200723211137.26641-3-s-anna@ti.com
The various CBASS interconnect nodes on K3 AM65x SoCs are defined
using the node name "interconnect". This is not a valid node name
as per the dt-schema. Fix these node names to use the standard name
used for SoC interconnects, "bus".
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Lokesh Vutla <lokeshvutla@ti.com>
Link: https://lore.kernel.org/r/20200723211137.26641-2-s-anna@ti.com
Pull crypto fixes from Herbert Xu:
- fix regression in af_alg that affects iwd
- restore polling delay in qat
- fix double free in ingenic on error path
- fix potential build failure in sa2ul due to missing Kconfig dependency
* 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/herbert/crypto-2.6:
crypto: af_alg - Work around empty control messages without MSG_MORE
crypto: sa2ul - add Kconfig selects to fix build error
crypto: ingenic - Drop kfree for memory allocated with devm_kzalloc
crypto: qat - add delay before polling mailbox
Pull x86 fixes from Thomas Gleixner:
"Three interrupt related fixes for X86:
- Move disabling of the local APIC after invoking fixup_irqs() to
ensure that interrupts which are incoming are noted in the IRR and
not ignored.
- Unbreak affinity setting.
The rework of the entry code reused the regular exception entry
code for device interrupts. The vector number is pushed into the
errorcode slot on the stack which is then lifted into an argument
and set to -1 because that's regs->orig_ax which is used in quite
some places to check whether the entry came from a syscall.
But it was overlooked that orig_ax is used in the affinity cleanup
code to validate whether the interrupt has arrived on the new
target. It turned out that this vector check is pointless because
interrupts are never moved from one vector to another on the same
CPU. That check is a historical leftover from the time where x86
supported multi-CPU affinities, but not longer needed with the now
strict single CPU affinity. Famous last words ...
- Add a missing check for an empty cpumask into the matrix allocator.
The affinity change added a warning to catch the case where an
interrupt is moved on the same CPU to a different vector. This
triggers because a condition with an empty cpumask returns an
assignment from the allocator as the allocator uses for_each_cpu()
without checking the cpumask for being empty. The historical
inconsistent for_each_cpu() behaviour of ignoring the cpumask and
unconditionally claiming that CPU0 is in the mask struck again.
Sigh.
plus a new entry into the MAINTAINER file for the HPE/UV platform"
* tag 'x86-urgent-2020-08-30' of git://git.kernel.org/pub/scm/linux/kernel/git/tip/tip:
genirq/matrix: Deal with the sillyness of for_each_cpu() on UP
x86/irq: Unbreak interrupt affinity setting
x86/hotplug: Silence APIC only after all interrupts are migrated
MAINTAINERS: Add entry for HPE Superdome Flex (UV) maintainers
