Pull SoC driver updates from Arnd Bergmann:
"This is the first half of the driver changes:
- A treewide interface change to the "syscore" operations for power
management, as a preparation for future Tegra specific changes
- Reset controller updates with added drivers for LAN969x, eic770 and
RZ/G3S SoCs
- Protection of system controller registers on Renesas and Google
SoCs, to prevent trivially triggering a system crash from e.g.
debugfs access
- soc_device identification updates on Nvidia, Exynos and Mediatek
- debugfs support in the ST STM32 firewall driver
- Minor updates for SoC drivers on AMD/Xilinx, Renesas, Allwinner, TI
- Cleanups for memory controller support on Nvidia and Renesas"
* tag 'soc-drivers-6.19' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (114 commits)
memory: tegra186-emc: Fix missing put_bpmp
Documentation: reset: Remove reset_controller_add_lookup()
reset: fix BIT macro reference
reset: rzg2l-usbphy-ctrl: Fix a NULL vs IS_ERR() bug in probe
reset: th1520: Support reset controllers in more subsystems
reset: th1520: Prepare for supporting multiple controllers
dt-bindings: reset: thead,th1520-reset: Add controllers for more subsys
dt-bindings: reset: thead,th1520-reset: Remove non-VO-subsystem resets
reset: remove legacy reset lookup code
clk: davinci: psc: drop unused reset lookup
reset: rzg2l-usbphy-ctrl: Add support for RZ/G3S SoC
reset: rzg2l-usbphy-ctrl: Add support for USB PWRRDY
dt-bindings: reset: renesas,rzg2l-usbphy-ctrl: Document RZ/G3S support
reset: eswin: Add eic7700 reset driver
dt-bindings: reset: eswin: Documentation for eic7700 SoC
reset: sparx5: add LAN969x support
dt-bindings: reset: microchip: Add LAN969x support
soc: rockchip: grf: Add select correct PWM implementation on RK3368
soc/tegra: pmc: Add USB wake events for Tegra234
amba: tegra-ahb: Fix device leak on SMMU enable
...
Pull thermal control updates from Rafael Wysocki:
"These add Nova Lake processor support to the Intel thermal drivers and
DPTF code, update thermal control documentation, simplify the ACPI
DPTF code related to thermal control, add QCS8300 compatible to the
tsens thermal DT bindings, add DT bindings for NXP i.MX91 thermal
module and add support for it to the imx91 thermal driver, update a
few other thermal drivers and fix a format string issue in a thermal
utility:
- Add Nova Lake processor thermal device to the int340x
processor_thermal driver, add DLVR support for Nova Lake to it, add
Nova Lake support to the ACPI DPTF code, document thermal
throttling on Intel platforms, and update workload type hint
interface documentation (Srinivas Pandruvada)
- Remove int340x thermal scan handler from the ACPI DPTF code because
it turned out to be unnecessary (Slawomir Rosek)
- Clean up the Intel int340x thermal driver (Kaushlendra Kumar)
- Document the RZ/V2H TSU DT bindings (Ovidiu Panait)
- Document the Kaanapali Temperature Sensor (Manaf Meethalavalappu
Pallikunhi)
- Document R-Car Gen4 and RZ/G2 support in driver comment (Marek
Vasut)
- Convert to DEFINE_SIMPLE_DEV_PM_OPS() in R-Car [Gen3] (Geert
Uytterhoeven)
- Fix format string bug in thermal-engine (Malaya Kumar Rout)
- Make ipq5018 tsens standalone compatible (George Moussalem)
- Add the QCS8300 compatible for QCom Tsens (Gaurav Kohli)
- Add support for the NXP i.MX91 thermal module, including the DT
bindings (Pengfei Li)"
* tag 'thermal-6.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal/drivers/imx91: Add support for i.MX91 thermal monitoring unit
dt-bindings: thermal: fsl,imx91-tmu: add bindings for NXP i.MX91 thermal module
dt-bindings: thermal: tsens: Add QCS8300 compatible
dt-bindings: thermal: qcom-tsens: make ipq5018 tsens standalone compatible
tools/thermal/thermal-engine: Fix format string bug in thermal-engine
docs: driver-api/thermal/intel_dptf: Add new workload type hint
thermal/drivers/rcar_gen3: Convert to DEFINE_SIMPLE_DEV_PM_OPS()
thermal/drivers/rcar: Convert to DEFINE_SIMPLE_DEV_PM_OPS()
Documentation: thermal: Document thermal throttling on Intel platforms
ACPI: DPTF: Support Nova Lake
thermal: intel: int340x: Add DLVR support for Nova Lake
thermal: int340x: processor_thermal: Add Nova Lake processor thermal device
thermal: intel: int340x: Replace sprintf() with sysfs_emit()
thermal: intel: int340x: Use symbolic constant for UUID comparison
thermal/drivers/rcar_gen3: Document R-Car Gen4 and RZ/G2 support in driver comment
dt-bindings: thermal: qcom-tsens: document the Kaanapali Temperature Sensor
dt-bindings: thermal: r9a09g047-tsu: Document RZ/V2H TSU
ACPI: DPTF: Remove int340x thermal scan handler
thermal: intel: Select INT340X_THERMAL from INTEL_SOC_DTS_THERMAL
Pull thermal control changes for 6.19-rc1 from Daniel Lezcano:
"- Document the RZ/V2H TSU DT bindings (Ovidiu Panait)
- Document the Kaanapali Temperature Sensor (Manaf Meethalavalappu
Pallikunhi)
- Document R-Car Gen4 and RZ/G2 support in driver comment (Marek Vasut)
- Convert to DEFINE_SIMPLE_DEV_PM_OPS in the R-Car [Gen3] (Geert
Uytterhoeven)
- Fix format string bug in thermal-engine (Malaya Kumar Rout)
- Make ipq5018 tsens standalone compatible (George Moussalem)
- Add the QCS8300 compatible for the QCom Tsens (Gaurav Kohli)
- Add the support for the NXP i.MX91 thermal module, including the DT
bindings (Pengfei Li)
* tag 'thermal-v6.19-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
thermal/drivers/imx91: Add support for i.MX91 thermal monitoring unit
dt-bindings: thermal: fsl,imx91-tmu: add bindings for NXP i.MX91 thermal module
dt-bindings: thermal: tsens: Add QCS8300 compatible
dt-bindings: thermal: qcom-tsens: make ipq5018 tsens standalone compatible
tools/thermal/thermal-engine: Fix format string bug in thermal-engine
thermal/drivers/rcar_gen3: Convert to DEFINE_SIMPLE_DEV_PM_OPS()
thermal/drivers/rcar: Convert to DEFINE_SIMPLE_DEV_PM_OPS()
thermal/drivers/rcar_gen3: Document R-Car Gen4 and RZ/G2 support in driver comment
dt-bindings: thermal: qcom-tsens: document the Kaanapali Temperature Sensor
dt-bindings: thermal: r9a09g047-tsu: Document RZ/V2H TSU
Introduce support for the i.MX91 thermal monitoring unit, which features a
single sensor for the CPU. The register layout differs from other chips,
necessitating the creation of a dedicated file for this.
This sensor provides a resolution of 1/64°C (6-bit fraction). For actual
accuracy, refer to the datasheet, as it varies depending on the chip grade.
Provide an interrupt for end of measurement and threshold violation and
Contain temperature threshold comparators, in normal and secure address
space, with direction and threshold programmability.
Datasheet Link: https://www.nxp.com/docs/en/data-sheet/IMX91CEC.pdf
Signed-off-by: Pengfei Li <pengfei.li_1@nxp.com>
Signed-off-by: Peng Fan <peng.fan@nxp.com>
Signed-off-by: Frank Li <Frank.Li@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://patch.msgid.link/20251020-imx91tmu-v7-2-48d7d9f25055@nxp.com
The current read_raw() implementation of the TPMI, MMIO and MSR
interfaces does not distinguish between atomic and non-atomic callers.
rapl_msr_read_raw() uses rdmsrq_safe_on_cpu(), which can sleep and
issue cross CPU calls. When MSR-based RAPL PMU support is enabled, PMU
event handlers can invoke this function from atomic context where
sleeping or rescheduling is not allowed. In atomic context, the caller
is already executing on the target CPU, so a direct rdmsrq() is
sufficient.
To support such usage, introduce an atomic flag to the read_raw()
interface to allow callers pass the context information. Modify the
common RAPL code to propagate this flag, and set the flag to reflect
the calling contexts.
Utilize the atomic flag in rapl_msr_read_raw() to perform direct MSR
read with rdmsrq() when running in atomic context, and a sanity check
to ensure target CPU matches the current CPU for such use cases.
The TPMI and MMIO implementations do not require special atomic
handling, so the flag is ignored in those paths.
This is a preparatory patch for adding MSR-based RAPL PMU support.
Signed-off-by: Kuppuswamy Sathyanarayanan <sathyanarayanan.kuppuswamy@linux.intel.com>
Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
[ rjw: Subject tweak ]
Link: https://patch.msgid.link/20251121000539.386069-2-sathyanarayanan.kuppuswamy@linux.intel.com
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Several drivers can benefit from registering per-instance data along
with the syscore operations. To achieve this, move the modifiable fields
out of the syscore_ops structure and into a separate struct syscore that
can be registered with the framework. Add a void * driver data field for
drivers to store contextual data that will be passed to the syscore ops.
Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org>
Signed-off-by: Thierry Reding <treding@nvidia.com>
Replace sizeof() with a symbolic constant for UUID matching to maintain
existing ABI behavior while improving code clarity. The current behavior
of comparing only the first 7 characters is sufficient to distinguish
all UUIDs and changing to full string comparison would alter the kernel
ABI, potentially breaking existing userspace applications.
Use a defined constant to make the truncated comparison explicit and
maintainable.
Signed-off-by: Kaushlendra Kumar <kaushlendra.kumar@intel.com>
[ rjw: Subject adjustments ]
Link: https://patch.msgid.link/20251030035955.62171-1-kaushlendra.kumar@intel.com
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The IRQ used by the Intel SoC DTS thermal device for critical
overheating notification is listed in _CRS of device INT3401 which
therefore needs to be enumerated for Intel SoC DTS thermal to work.
The enumeration happens by binding the int3401_thermal driver to the
INT3401 platform device. Thus CONFIG_INT340X_THERMAL is in fact
necessary for enumerating it, so checking CONFIG_INTEL_SOC_DTS_THERMAL
in int340x_thermal_handler_attach() is pointless and INT340X_THERMAL
may as well be selected by INTEL_SOC_DTS_THERMAL.
Signed-off-by: Slawomir Rosek <srosek@google.com>
[ rjw: New subject ]
Link: https://patch.msgid.link/20251103162516.2606158-2-srosek@google.com
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
- Restore sort order in MAINTAINERS and Kconfig,
- Remove empty trailing line from Makefile.
Fixes: 19d3a401a6 ("thermal/drivers/renesas/rzg3e: Add thermal driver for the Renesas RZ/G3E SoC")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Merge a thermal driver fix for 6.18 from Daniel Lezcano:
"- Add missing file when importing conflicting change for the Renesas
RZ/G3E thermal driver (Daniel Lezcano)"
* tag 'thermal-v6.18-rc1-2' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
thermal/drivers/renesas/rzg3e: Fix add thermal driver for the Renesas RZ/G3E SoC
Merge updates of thermal drivers for 6.18-rc1 from Daniel Lezcano:
"- Add the QCS615 compatible DT bindings for QCom platforms (Gaurav
Kohli)
- Support fallback trimming values when the fuse is empty in the R-Car
driver (Marek Vasut)
- Remove unneeded semicolon in the Mediatek LVTS driver (Jiapeng
Chong)
- Fix the LMH Kconfig option by selecting QCOM_SCM and take the
opportunity to add the COMPILE_TEST option for the QCom's LMH
feature (Dmitry Baryshkov)
- Fix the missing includes and incorrect error message in the Qcom's
LMH driver (Dmitry Baryshkov)
- Fix comment typo and add the documentation in the Kconfig for the
R-Car Gen3 and Gen4 (Marek Vasut)
- Add Tegra114 SOCTHERM support (Svyatoslav Ryhel)
- Rename the functions name in the driver to be consistent and generic
with the different R-Car platform variants (Wolfram Sang)
- Register the TI K3 J72xx bandgap sensor as a hwmon sensor too
(Michael Walle)
- Add and document the thermal sensor unit reporting the junction
temperature of the RZ/G3S SoC (Claudiu Beznea)
- Support the GRF in the Rockchip driver (Sebastian Reichel)
- Add a temperature IIO sensor channel in the generic thermal ADC
driver (Svyatoslav Ryhel)
- Document the temperature sensor on the QCOM's Glymur platform (Manaf
Meethalavalappu)
- Add and document the thermal sensor unit reporting the junction
temperature of the RZ/G3E SoC (John Madieu)"
* tag 'thermal-v6.18-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (24 commits)
dt-bindings: thermal: qcom-tsens: Document the Glymur temperature Sensor
thermal/drivers/renesas/rzg3e: Add thermal driver for the Renesas RZ/G3E SoC
dt-bindings: thermal: r9a09g047-tsu: Document the TSU unit
thermal/drivers/thermal-generic-adc: Add temperature sensor channel
dt-bindings: thermal: rockchip: Tighten grf requirements
thermal/drivers/rockchip: Shut up GRF warning
thermal/drivers/rockchip: Unify struct rockchip_tsadc_chip format
thermal/drivers/renesas/rzg3s: Add thermal driver for the Renesas RZ/G3S SoC
dt-bindings: thermal: r9a08g045-tsu: Document the TSU unit
thermal/drivers/k3_j72xx_bandgap: Register sensors with hwmon
thermal/drivers/rcar_gen3: Fix mapping SoCs to generic Gen4 entry
thermal/drivers/tegra: Add Tegra114 specific SOCTHERM driver
dt-bindings: thermal: add Tegra114 soctherm header
thermal/drivers/tegra/soctherm-fuse: Prepare calibration for Tegra114 support
dt-bindings: thermal: Document Tegra114 SOCTHERM Thermal Management System
thermal/drivers/rcar_gen3: Document Gen4 support in Kconfig entry
thermal/drivers/rcar_gen3: Fix comment typo
drivers/thermal/qcom/lmh: Fix incorrect error message
thermal/drivers/qcom/lmh: Add missing IRQ includes
thermal/drivers/qcom: Make LMH select QCOM_SCM
...
Merge an adjustment of the new Power Slider interface in the int340x
thermal driver.
* thermal-intel:
thermal: intel: int340x: Power Slider: Validate slider_balance range
The RZ/G3E SoC integrates a Temperature Sensor Unit (TSU) block designed
to monitor the chip's junction temperature. This sensor is connected to
channel 1 of the APB port clock/reset and provides temperature measurements.
It also requires calibration values stored in the system controller registers
for accurate temperature measurement. Add a driver for the Renesas RZ/G3E TSU.
[ dlezcano: Fixed conflict with "renesas: Add support for RZ/G3S" ]
Signed-off-by: John Madieu <john.madieu.xa@bp.renesas.com>
Reviewed-by: Biju Das <biju.das.jz@bp.renesas.com>
Link: https://lore.kernel.org/r/20250917170202.197929-3-john.madieu.xa@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
To avoid duplicating sensor functionality and conversion tables, this
design allows converting an ADC IIO channel's output directly into a
temperature IIO channel. This is particularly useful for devices where
hwmon isn't suitable or where temperature data must be accessible through
IIO.
One such device is, for example, the MAX17040 fuel gauge.
Signed-off-by: Svyatoslav Ryhel <clamor95@gmail.com>
Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Link: https://lore.kernel.org/r/20250903162749.109910-2-clamor95@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The Working Sample R-Car SoCs may not yet have thermal sensor trimming
values programmed into fuses, those fuses are blank instead. For such
SoCs, the driver includes fallback trimming values. Those values are
currently applied to all SoCs which use this driver.
Introduce support for per-SoC fallback trimming values in preparation
for SoCs which do not use these current trimming values. No functional
change is intended here.
Signed-off-by: Marek Vasut <marek.vasut+renesas@mailbox.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20250625181739.28391-1-marek.vasut+renesas@mailbox.org
When the module parameter slider_balance is set to the performance
slider value of 0, the SoC slider profile switches to the performance
mode.
This can cause the Linux power-profiles-daemon to change the system
power mode to performance from balanced mode. This happens when there
is only one platform profile registered as there will be no conflict
with other platform profiles.
Same issue occurs when the slider_balance is set to the power-saver
slider value.
Prevent module parameter slider_balance from overlapping with
performance and power-saver slider values by adding range validation.
Return an error when an invalid value is provided.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Link: https://patch.msgid.link/20250923205631.3056590-1-srinivas.pandruvada@linux.intel.com
[ rjw: Changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Intel int340x thermal driver changes for 6.18:
- Add support for new "power slider" firmware interface to the int340x
thermal driver end enable it for Panther Lake platforms (Srinivas
Pandruvada)
- Remove a redundant ACPI control method evaluation from the int340x
thermal driver (Salah Triki)
and clean it up.
* thermal-intel:
thermal: intel: selftests: workload_hint: Mask unsupported types
thermal: intel: int340x: Add module parameter to change slider offset
thermal: intel: int340x: Add module parameter for balanced Slider
thermal: intel: int340x: Enable power slider interface for Panther Lake
thermal: intel: int340x: Add support for power slider
thermal: intel: int340x: Remove redundant acpi_has_method() call
The current behavior of the Step-wise thermal governor is to increase
the cooling level one step at a time after trip point threshold passing
by thermal zone temperature until the temperature stops to rise. Then,
nothing is done until the temperature decreases below the (possibly
updated) trip point threshold, at which point the cooling level is
reduced straight to the applicable minimum.
While this generally works, it is not in agreement with the throttling
logic description comment in step_wise_manage() any more after some
relatively recent changes, and in the case of passive cooling, it may
lead to undesirable performance oscillations between high and low
levels.
For this reason, modify the governor's cooling device state selection
function, get_target_state(), to reduce cooling by one level even if
the temperature is still above the thermal zone threshold, but the
temperature has started to fall down. However, ensure that the cooling
level will remain above the applicable minimum in that case to pull
the zone temperature further down, possibly until it falls below the
trip threshold (which may now be equal to the low temperature of the
trip).
Doing so should help higher performance to be restored earlier in some
cases which is desirable especially for passive trip points with
relatively high hysteresis values.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://patch.msgid.link/1947735.tdWV9SEqCh@rafael.j.wysocki
[ rjw: Changelog edits ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The cooling logic description comment next to the get_target_state()
definition is slightly ambiguous in what it means by "lower cooling
state", so clarify that by replacing the ambuguous phrase with "the
minimum applicable cooling state".
No functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://patch.msgid.link/4690596.LvFx2qVVIh@rafael.j.wysocki
SoC slider value is set by the user (or the default when user has not
modified it). To enhance power efficiency dynamically, the firmware can
optionally auto-adjust the slider value based on the current workload.
This adjustment is governed by an additional parameter known as the
"slider offset". This offset permits the firmware to increase the slider
value up to and including "SoC slider + slider offset".
Add a module parameter to specify this "slier offset" value.
By default, the SoC slider offset is set to 0. This means that SoC is not
allowed to switch slider position.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Link: https://patch.msgid.link/20250825132315.75521-5-srinivas.pandruvada@linux.intel.com
[ rjw: Comment and module param description adjustments ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
By default, the SoC slider value for the "balanced" platform profile is
set to 3. This update introduces a new module parameter, allowing users
to modify this default value.
The module parameter can be specified during load time to set a custom
slider value for the "balanced" profile. If the module parameter is not
specified at load time and is updated later, the new value will only take
effect after the next write of "balanced" to the sysfs "profile"
attribute.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Link: https://patch.msgid.link/20250825132315.75521-4-srinivas.pandruvada@linux.intel.com
[ rjw: Minor adjustments of module param description ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add support for system wide energy performance preference using a SoC
slider interface defined via processor thermal PCI device MMIO space.
Using Linux platform-profile class API, register a new platform profile.
Provide three platform power profile choices:
"performance", "balanced" and "low-power".
Profile sysfs is located at:
/sys/class/platform-profile/platform-profile-*
where attribute "name" is presented as "SoC Power Slider".
At boot by default the slider is set to balanced mode. This profile is
changed by user space based on user preference via power profile daemon
or directly writing to the "profile" sysfs attribute.
Add a CPU model specific processor thermal device feature
PROC_THERMAL_FEATURE_SOC_POWER_SLIDER. When enabled for a CPU model,
slider interface is registered.
During system suspend callback save slider register and restore during
resume callback.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Link: https://patch.msgid.link/20250825132315.75521-2-srinivas.pandruvada@linux.intel.com
[ rjw: Removal of redundant outer parens from one expression ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
