arm64: dts: rockchip: Add idle cooling devices to rk3399

The thermal framework accepts now the cpu idle cooling device as an
alternative when the cpufreq cooling device fails.

Add the node in the DT so the cooling devices will be present and the
platforms can extend the thermal zone definition to add them.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20211001161728.1729664-1-daniel.lezcano@linaro.org
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
This commit is contained in:
Daniel Lezcano
2021-10-01 18:17:28 +02:00
committed by Heiko Stuebner
parent 5c9e66c6b7
commit 43f9699b0c

View File

@@ -124,6 +124,12 @@ cpu_b0: cpu@100 {
#cooling-cells = <2>; /* min followed by max */
dynamic-power-coefficient = <436>;
cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
thermal-idle {
#cooling-cells = <2>;
duration-us = <10000>;
exit-latency-us = <500>;
};
};
cpu_b1: cpu@101 {
@@ -136,6 +142,12 @@ cpu_b1: cpu@101 {
#cooling-cells = <2>; /* min followed by max */
dynamic-power-coefficient = <436>;
cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
thermal-idle {
#cooling-cells = <2>;
duration-us = <10000>;
exit-latency-us = <500>;
};
};
idle-states {