Marco Felsch e942307556 iio: temperature: tmp117: cosmetic alignment cleanup ...

Align the code correctly if possible and align the channel bit mask to
make it easier to read.

Signed-off-by: Marco Felsch <m.felsch@pengutronix.de>
Link: https://lore.kernel.org/r/20230228090518.529811-6-m.felsch@pengutronix.de
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>

2023-03-11 12:18:29 +00:00

..

hid-sensor-temperature.c

iio: hid-sensors: Update header includes

2021-06-16 14:53:13 +01:00

iqs620at-temp.c

iio: temperature: iqs620at-temp: Add support for V3 silicon

2022-02-14 13:07:33 +00:00

Kconfig

iio: temperature: Add driver support for Maxim MAX30208

2022-11-23 20:20:32 +00:00

ltc2983.c

iio: temperature: ltc2983: support more parts

2022-11-23 19:54:00 +00:00

Makefile

iio: temperature: Add driver support for Maxim MAX30208

2022-11-23 20:20:32 +00:00

max30208.c

iio: temperature: Add driver support for Maxim MAX30208

2022-11-23 20:20:32 +00:00

max31856.c

iio: temperature: max31856: Make use of device properties

2022-04-28 19:22:55 +01:00

max31865.c

iio: temp: max31865: Fix alignment for DMA safety

2022-06-14 11:53:19 +01:00

maxim_thermocouple.c

iio: temp: maxim_thermocouple: Fix alignment for DMA safety

2022-06-14 11:53:19 +01:00

mlx90614.c

iio: temperature: mlx90614: Convert to i2c's .probe_new()

2022-11-23 20:20:32 +00:00

mlx90632.c

iio: temperature: mlx90632: Convert to i2c's .probe_new()

2022-11-23 20:20:32 +00:00

tmp006.c

iio: temperature: tmp006: Convert to i2c's .probe_new()

2022-11-23 20:20:32 +00:00

tmp007.c

iio: temperature: tmp007: Convert to i2c's .probe_new()

2022-11-23 20:20:32 +00:00

tmp117.c

iio: temperature: tmp117: cosmetic alignment cleanup

2023-03-11 12:18:29 +00:00

tsys01.c

iio: temperature: tsys01: Convert to i2c's .probe_new()

2022-11-23 20:20:32 +00:00

tsys02d.c

iio: temperature: tsys02d: Convert to i2c's .probe_new()

2022-11-23 20:20:32 +00:00