Georgi writes:
interconnect changes for 5.17
Here are the interconnect changes for the 5.17-rc1 merge window
consisting of new drivers, minor changes and fixes.
New drivers:
- New driver for MSM8996 platforms
- New driver for SC7280 EPSS L3 hardware
- New driver for QCM2290 platforms
- New driver for SM8450 platforms
Driver changes:
- dt-bindings: interconnect: Combine SDM660 bindings into RPM schema
- icc-rpm: Add support for bus power domain
- icc-rpm: Use NOC_QOS_MODE_INVALID for qos_mode check
- icc-rpm: Define ICC device type
- icc-rpm: Add QNOC type QoS support
- icc-rpm: Support child NoC device probe
- icc-rpm: Prevent integer overflow in rate
- icc-rpmh: Add BCMs to commit list in pre_aggregate
Signed-off-by: Georgi Djakov <djakov@kernel.org>
* tag 'icc-5.17-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/djakov/icc:
interconnect: qcom: Add QCM2290 driver support
dt-bindings: interconnect: Add Qualcomm QCM2290 NoC support
interconnect: icc-rpm: Support child NoC device probe
interconnect: icc-rpm: Add QNOC type QoS support
interconnect: icc-rpm: Define ICC device type
interconnect: qcom: Add SM8450 interconnect provider driver
dt-bindings: interconnect: Add Qualcomm SM8450 DT bindings
interconnect: qcom: rpm: Prevent integer overflow in rate
interconnect: icc-rpm: Use NOC_QOS_MODE_INVALID for qos_mode check
interconnect: qcom: icc-rpmh: Add BCMs to commit list in pre_aggregate
interconnect: qcom: Add MSM8996 interconnect provider driver
dt-bindings: interconnect: Add Qualcomm MSM8996 DT bindings
interconnect: icc-rpm: Add support for bus power domain
dt-bindings: interconnect: Combine SDM660 bindings into RPM schema
interconnect: qcom: Add EPSS L3 support on SC7280
dt-bindings: interconnect: Add EPSS L3 DT binding on SC7280
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