Pull x86 cpuid updates from Ingo Molnar:
- CPUID API updates (Ahmed S. Darwish):
- Introduce a centralized CPUID parser
- Introduce a centralized CPUID data model
- Introduce <asm/cpuid/leaf_types.h>
- Rename cpuid_leaf()/cpuid_subleaf() APIs
- treewide: Explicitly include the x86 CPUID headers
- Update to x86-cpuid-db v3.1 (Maciej Wieczor-Retman)
- Continued removal of pre-i586 support and related simplifications
(Ingo Molnar)
- Add Intel CPU model number for rugged Panther Lake (Tony Luck)
- Misc fixes, updates and cleanups by Arnd Bergmann, Chao Gao, Lukas
Bulwahn, Sohil Mehta, Maciej Wieczor-Retman.
* tag 'x86-cpu-2026-06-14' of gitolite.kernel.org:pub/scm/linux/kernel/git/tip/tip: (25 commits)
x86/cpu: Make CONFIG_X86_CX8 unconditional
x86/cpu: Remove unused !CONFIG_X86_TSC code
x86/cpuid: Update bitfields to x86-cpuid-db v3.1
tools/x86/kcpuid: Update bitfields to x86-cpuid-db v3.1
x86/cpu: Make CONFIG_X86_TSC unconditional
MAINTAINERS: Drop obsolete FPU EMULATOR section
x86/cpu: Fix a F00F bug warning and clean up surrounding code
x86/cpu: Add Intel CPU model number for rugged Panther Lake
x86/cpuid: Introduce a centralized CPUID parser
x86/cpu: Introduce a centralized CPUID data model
x86/cpuid: Introduce <asm/cpuid/leaf_types.h>
x86/cpuid: Rename cpuid_leaf()/cpuid_subleaf() APIs
x86/cpu: Do not include the CPUID API header in asm/processor.h
Documentation: core-api/cpu_hotplug: Remove stale cpu0_hotplug docs
x86/cpu, cpufreq: Remove AMD ELAN support
x86/fpu: Remove the math-emu/ FPU emulation library
x86/fpu: Remove the 'no387' boot option
x86/fpu: Remove MATH_EMULATION and related glue code
treewide: Explicitly include the x86 CPUID headers
x86/cpu: Remove the CONFIG_X86_INVD_BUG quirk
...
Merge thermal control testing facility updates for 7.2:
- Replace sscanf() with kstrtoul() or kstrtoint() in several places in
the thermal testing code (Ovidiu Panait)
- Make the thermal testing facility reject missing command arguments to
avoid NULL pointer dereferences (Samuel Moelius)
* thermal-testing:
thermal: sysfs: Replace sscanf() with kstrtoul()
thermal: testing: Replace sscanf() with kstrtoint()
thermal: testing: reject missing command arguments
The thermal testing debugfs command parser splits commands at ':' and
passes the right-hand side to the command implementation. Commands such
as deltz, tzaddtrip, tzreg, and tzunreg require a zone id, but writing
one of those command names without ':' leaves the argument pointer NULL.
The command implementations parse the id with sscanf(arg, "%d", ...), so
the missing-argument form dereferences a NULL pointer from the debugfs
write path.
Reject missing arguments in tt_command_exec() before calling handlers
that require an id.
Fixes: f6a034f2df ("thermal: Introduce a debugfs-based testing facility")
Assisted-by: Codex:gpt-5.5-cyber-preview
Signed-off-by: Samuel Moelius <sam.moelius@trailofbits.com>
Link: https://patch.msgid.link/20260605185212.2491144-1-sam.moelius@trailofbits.com
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add a no_irq_wake flag to struct tsens_plat_data to allow platforms
to control whether TSENS interrupts should be configured as wakeup
sources.
Create a new data_automotive structure and add compatible strings for
automotive TSENS variants (SA8775P, SA8255P) with wakeup interrupts
disabled.
Automotive platforms can enter a low-power parking suspend state where the
application processors and thermal mitigation paths are not active. In this
state, waking the system due to TSENS threshold interrupts does not enable
useful thermal action, but it does repeatedly break suspend residency and
increase battery drain.
Allow these automotive variants to keep TSENS monitoring enabled during
normal runtime while opting out of TSENS wakeup interrupts during suspend,
so the system can remain in low power until ignition/resume.
Signed-off-by: Priyansh Jain <priyansh.jain@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Link: https://patch.msgid.link/20260601-tsens_interrupt_wake_control-v2-2-ce9570946abd@oss.qualcomm.com
This change improves power management by using the standardized PM
framework for wake IRQ handling.
Move wake IRQ control to the PM suspend/resume path:
- store uplow/critical IRQ numbers in struct tsens_priv
- enable wake IRQs in tsens_suspend_common() when wakeup is allowed
- disable wake IRQs in tsens_resume_common()
- mark the device wakeup-capable during probe
This aligns TSENS wake behavior with suspend flow and avoids keeping
wake IRQs permanently enabled during runtime.
Signed-off-by: Priyansh Jain <priyansh.jain@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Link: https://patch.msgid.link/20260601-tsens_interrupt_wake_control-v2-1-ce9570946abd@oss.qualcomm.com
Extend the cooling device specifier parsing to support an optional
cooling device identifier (cdev_id).
Two formats are now supported:
- Legacy format:
<&cdev lower upper>
- Indexed format:
<&cdev cdev_id lower upper>
When the indexed format is used, both the device node and the
cdev_id must match in order to bind a cooling device to a thermal
zone. The legacy format continues to match on the device node only,
preserving backward compatibility.
Update the parsing logic accordingly to handle both formats and
extract the mitigation limits from the appropriate arguments.
This is a preparatory step for upcoming DT bindings describing
cooling devices using (device node, id) tuples instead of child
nodes.
No functional change for existing device trees.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org>
Link: https://patch.msgid.link/20260526140802.1059293-21-daniel.lezcano@oss.qualcomm.com
Extend the OF cooling device registration to support an explicit
cooling device identifier (cdev_id), preparing for upcoming DT
bindings where cooling devices are identified by a tuple (device node,
id) instead of relying on child nodes.
Introduce a new helper:
devm_thermal_of_cooling_device_register()
which registers a cooling device using the device's of_node and an
explicit cdev_id. This complements the existing
devm_thermal_of_child_cooling_device_register() helper, which
remains dedicated to the legacy child-node based bindings.
Internally, factorize the devm registration logic into a common
helper to avoid code duplication.
Existing users are unaffected, as the child-based helper continues
to pass a default cdev_id of 0, preserving current behavior.
This change is a preparatory step for supporting indexed cooling
devices in thermal OF bindings.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org>
Link: https://patch.msgid.link/20260526140802.1059293-20-daniel.lezcano@oss.qualcomm.com
Introduce an identifier (cdev_id) for cooling devices registered from
device tree.
This prepares support for a new DT binding where cooling devices are
identified by a tuple (device node, ID), instead of relying on child
nodes.
Existing users are updated to pass a default ID of 0, preserving the
current behavior.
Future changes will extend the cooling map parsing to match cooling
devices based on both the device node and the ID.
No functional change intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org>
Link: https://patch.msgid.link/20260526140802.1059293-19-daniel.lezcano@oss.qualcomm.com
To clarify that the function operates on child nodes, rename:
devm_thermal_of_cooling_device_register()
|
v
devm_thermal_of_child_cooling_device_register()
Used the command:
find . -type f -name '*.[ch]' -exec \
sed -i 's/devm_thermal_of_cooling_device_register/\
devm_thermal_of_child_cooling_device_register/g' {} \;
Did not used clang-format-diff because it does not indent correctly
and checkpatch complained. Manually reindented to make checkpatch
happy
This prepares for upcoming support of cooling devices identified by
an ID rather than device tree child nodes.
No functional change.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org>
Link: https://patch.msgid.link/20260526140802.1059293-18-daniel.lezcano@oss.qualcomm.com
The functions:
- thermal_of_cooling_device_register()
- devm_thermal_of_cooling_device_register()
are specific to device tree usage but are currently implemented in
thermal_core.c.
Move them to thermal_of.c to better reflect the separation between
generic thermal core code and OF-specific logic.
This change is enabled by the recent split of the cooling device
registration into allocation and addition phases, allowing OF-specific
handling (such as device node assignment) to be isolated from the core.
No functional change intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org>
Link: https://patch.msgid.link/20260526140802.1059293-17-daniel.lezcano@oss.qualcomm.com
Introduce a device-managed variant of the non-OF cooling device
registration API.
This complements devm_thermal_of_cooling_device_register() and allows
non-device-tree users to register cooling devices with automatic
cleanup tied to the device lifecycle.
The helper relies on devm_add_action_or_reset() to release the cooling
device via thermal_cooling_device_release() on driver detach or probe
failure.
This keeps the API consistent across OF and non-OF users and avoids
manual cleanup in error paths.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org>
Link: https://patch.msgid.link/20260526140802.1059293-14-daniel.lezcano@oss.qualcomm.com
The SoC Thermal Management Unit (TMU) is essential for proper operation
of the SoCs. Kernel should not ask users choice of drivers when that
choice is obvious and known to the developers that answer should be
'yes' or 'module'.
Impact of making it default:
1. arm64 defconfig: No changes, already present in defconfig.
2. arm32: No changes, the driver is already selected by MACH_EXYNOS.
3. COMPILE_TEST builds: enable by default for arm32 or arm64 builds,
whenever ARCH_EXYNOS is selected. This has impact on build time and
feels logical, because if one selects ARCH_EXYNOS then probably by
default wants to build test it entirely. Kernels with COMPILE_TEST
are not supposed to be used for booting.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Link: https://patch.msgid.link/20260526135312.8697-2-krzysztof.kozlowski@oss.qualcomm.com
Invalid temperature measurements may be observed across the temperature
range specified in the device data sheet. The invalid temperature can
be read from any remote site and from any capture or report registers.
The invalid change in temperature can be positive or negative and the
resulting temperature can be outside the calibrated range, in which
case the TSR[ORL] or TSR[ORH] bit will be set.
Workaround:
Use the raising/falling edge threshold to filter out the invalid temp.
Check the TIDR register to make sure no jump happens When reading the temp.
i.MX93 ERR052243:
(https://www.nxp.com/webapp/Download?colCode=IMX93_2P87F&appType=license)
Signed-off-by: Jacky Bai <ping.bai@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Link: https://patch.msgid.link/20260430-imx93_tmu-v6-3-485459d7b54f@nxp.com
The existing TSENS temperature read logic polls the valid bit and then
reads the temperature register. When temperature reads are triggered
at very short intervals, this can race with hardware updates and allow
the temperature field to be read while it is still being updated.
In this case, the valid bit may already be asserted even though the
temperature value is transitioning, resulting in an incorrect reading.
Hardware programming guidelines require the temperature value and the
valid bit to be sampled atomically in the same read transaction. A
reading is considered valid only if the valid bit is observed set in
that same sample.
The guidelines further specify that software should attempt the
temperature read up to three times to account for transient update
windows. If none of the attempts yields a valid sample, a stable fallback
value must be returned: if the first and second samples match, the second
value is returned;otherwise, if the second and third samples match, the
third value is returned;if neither pair matches, -EAGAIN is returned.
Update the TSENS sensor read logic to implement atomic sampling along
with the recommended retry-and-compare fallback behavior. This removes
the race window and ensures deterministic temperature values in
accordance with hardware requirements.
Signed-off-by: Priyansh Jain <priyansh.jain@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Link: https://patch.msgid.link/20260514113643.1954111-1-priyansh.jain@oss.qualcomm.com
Some SoCs (e.g. T7) expose thermal calibration data through the secure
monitor rather than a directly accessible eFuse register. Add a use_sm
flag to amlogic_thermal_data to select this path, and retrieve the
firmware handle and tsensor_id from the "amlogic,secure-monitor" DT
phandle with one fixed argument.
Also introduce the amlogic,t7-thermal compatible using this new path.
While refactoring, fix a pre-existing bug where
amlogic_thermal_initialize() was called after
devm_thermal_of_zone_register(), causing the thermal framework to
read an uninitialized trim_info on zone registration.
Signed-off-by: Ronald Claveau <linux-kernel-dev@aliel.fr>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org>
Link: https://patch.msgid.link/20260424-add-thermal-t7-vim4-v5-4-9040ca36afe2@aliel.fr
proc_thermal_ptc_add() ignores the return value of ptc_create_groups()
causing the driver to silenty continue even if sysfs group creation
fails.
The thermal control interface would be unavailable with no indication
of failure.
Check the return value and on failure clean up any sysfs groups that
were successfully created before the error, then propagate the error to
the caller which already handles it correctly via goto err_rem_rapl.
Signed-off-by: Aravind Anilraj <aravindanilraj0702@gmail.com>
Link: https://patch.msgid.link/20260329070642.10721-3-aravindanilraj0702@gmail.com
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Use devm_thermal_of_cooling_device_register() to simplify resource
management and avoid manual cleanup in error paths.
As a side effect this change has the benefit of solving an existing
issue. Before, the function tegra_soctherm_remove() only called
debugfs_remove_recursive() and never called thermal_cooling_device_unregister()
for any of the cooling devices registered here.
After the driver removal, the thermal framework's cdev list would
still hold references to thermal_cooling_device objects whose devdata
pointer (ts) pointed to memory already freed by the platform device's
devm cleanup.
With this change, the cooling device is unregistered when the driver
is removed, thus fixing the issue above.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://patch.msgid.link/20260424160019.41710-2-daniel.lezcano@oss.qualcomm.com
This continues the effort to refactor workqueue APIs, which began with
the introduction of new workqueues and a new alloc_workqueue flag in:
commit 128ea9f6cc ("workqueue: Add system_percpu_wq and system_dfl_wq")
commit 930c2ea566 ("workqueue: Add new WQ_PERCPU flag")
The refactoring is going to alter the default behavior of
alloc_workqueue() to be unbound by default.
With the introduction of the WQ_PERCPU flag (equivalent to !WQ_UNBOUND),
any alloc_workqueue() caller that doesn’t explicitly specify WQ_UNBOUND
must now use WQ_PERCPU. For more details see the Link tag below.
This workqueue has no benefits being per-CPU, so make it unbound adding
WQ_UNBOUND, removing also the WQ_POWER_EFFICIENT flag.
Link: https://lore.kernel.org/all/20250221112003.1dSuoGyc@linutronix.de/
Suggested-by: Tejun Heo <tj@kernel.org>
Signed-off-by: Marco Crivellari <marco.crivellari@suse.com>
[ rjw: Subject tweak ]
Link: https://patch.msgid.link/20260515084920.70544-1-marco.crivellari@suse.com
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Since commit
13f4e660a1 ("thermal/core: Split __thermal_cooling_device_register()
into two functions")
thermal_cooling_device_setup_sysfs() is called before the
->get_max_state() callback in thermal_cooling_device_add().
However, cooling_device_stats_setup() allocates space based on
cdev->max_state, which is not initialized at that point.
With CONFIG_THERMAL_STATISTICS=y, an out of bounds access happens
inside thermal_cooling_device_stats_update(), followed by a kernel
crash:
Unable to handle kernel paging request at virtual address ffff800081329e60
Call trace:
queued_spin_lock_slowpath+0x1cc/0x320 (P)
thermal_cooling_device_stats_update+0x28/0xa4
__thermal_cdev_update+0x74/0x88
thermal_cdev_update+0x44/0x58
step_wise_manage+0x1b8/0x300
__thermal_zone_device_update+0x270/0x414
thermal_zone_device_check+0x28/0x40
process_one_work+0x150/0x290
worker_thread+0x18c/0x300
kthread+0x114/0x120
ret_from_fork+0x10/0x20
To fix this, restore the original ordering of ->get_max_state() and
thermal_cooling_device_setup_sysfs(). Note that with this reordering,
the dev_set_name() and ->get_max_state() error paths now reach
thermal_cdev_release() without setup_sysfs() having run. This is safe
because cdev->stats is NULL in that case and destroy_sysfs() is a no-op.
Fixes: 13f4e660a1 ("thermal/core: Split __thermal_cooling_device_register() into two functions")
Signed-off-by: Ovidiu Panait <ovidiu.panait.rb@renesas.com>
Reviewed-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Link: https://patch.msgid.link/20260520165835.90974-1-ovidiu.panait.rb@renesas.com
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
In preparation for the upcoming changes separating OF and non-OF code,
split __thermal_cooling_device_register() into allocation and addition
phases.
This allows moving the device node assignment out of the core
initialization path.
This change is not a trivial split. The lifetime of the cooling device
is managed by the device core through put_device(), which triggers
thermal_release() to free all associated resources.
With the introduction of thermal_cooling_device_alloc(), the allocation
path must mirror what thermal_release() undoes. In contrast,
thermal_cooling_device_add() must not perform any rollback and relies
on put_device() for cleanup on error paths. This avoids both double
free and resource leaks.
As part of this rework, add the missing device_initialize() call when
allocating the cooling device.
Suggested-by: Rafael J. Wysocki <rafael@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
[ rjw: Replace device_register() with device_add() ]
[ rjw: Rebase on top of previously applied material ]
Link: https://patch.msgid.link/20260505144447.2853933-1-daniel.lezcano@oss.qualcomm.com
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Instead of passing NULL as the last argument to __hwmon_device_register()
in hwmon_device_register_for_thermal() and then adding each temperature
sysfs attribute to the hwmon device via device_create_file(), redefine
hwmon_device_register_for_thermal() to take an extra_groups argument
that will be passed to __hwmon_device_register(), define an attribute
group with a proper .is_visible() callback for the temperature
attributes and a related attribute groups pointer, and pass the latter
to hwmon_device_register_for_thermal().
This causes the code to be way more straightforward and closer to
what the other users of the hwmon subsystem do.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Link: https://patch.msgid.link/8704209.T7Z3S40VBb@rafael.j.wysocki
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The current code creates one hwmon device per thermal zone type and that
device is registered under the first thermal zone of the given type.
That turns out to be problematic when the thermal zone holding the
hwmon device is removed.
For example, say that there are two ACPI thermal zones on a system
/sys/devices/virtual/thermal/thermal_zone0/
/sys/devices/virtual/thermal/thermal_zone1/
The current code registers a hwmon class device for thermal_zone0 only:
/sys/devices/virtual/thermal/thermal_zone0/hwmon0/
because the type is "acpitz" for both of them, but it adds a sysfs
attribute that belongs to thermal_zone1 under it:
/sys/devices/virtual/thermal/thermal_zone0/hwmon0/temp2_input
There is also
/sys/devices/virtual/thermal/thermal_zone0/hwmon0/temp1_input
which belongs to thermal_zone0.
When thermal_zone0 is removed, say because the ACPI thermal driver is
unbound from the underlying platform device, the removal code skips the
removal of hwmon0 because of the temp2_input attribute belonging to
thermal_zone1 which effectively prevents thermal_zone0 removal from
making progress.
To address this problem, rework the thermal hwmon code to register one
hwmon device for each thermal zone, but since user space utilities
produce confusing output in some cases when there are multiple hwmon
devices with the same name attribute value present under thermal zones
of the same type, append the thermal zone ID preceded by an underline
character to the name of the hwmon device registered for that thermal
zone.
Link: https://lore.kernel.org/linux-pm/20260402021828.16556-1-liujia6264@gmail.com/
Fixes: f6b6b52ef7 ("thermal_hwmon: Pass the originating device down to hwmon_device_register_with_info")
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Link: https://patch.msgid.link/3070412.e9J7NaK4W3@rafael.j.wysocki
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Since the return value of thermal_zone_crit_temp_valid() depends on
the behavior of the thermal zone .get_crit_temp() callback which
may change over time in theory, thermal_remove_hwmon_sysfs() may
attempt to remove a critical temperature attribute that has not
been created, passing a pointer to an uninitialized attribute
structure to device_remove_file().
To avoid that, set a flag in struct thermal_hwmon_temp after creating
a critical temperature attribute and use the value of that flag to
decide whether or not the attribute needs to be removed.
Fixes: e8db5d6736 ("thermal: hwmon: Make the check for critical temp valid consistent")
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Link: https://patch.msgid.link/2437056.ElGaqSPkdT@rafael.j.wysocki
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Thermal governors are only unregistered in the thermal_init() error
path and they actually are only deleted from thermal_governor_list.
Put the entire code needed to do that to thermal_unregister_governors()
and rearrange thermal_init() to call that function also when
thermal_register_governors() returns an error.
This allows thermal_unregister_governor() to be dropped
and thermal_register_governor() that is only called by
thermal_register_governors() can be made static __init, so the
headers of these two functions can be dropped from thermal_core.h.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Link: https://patch.msgid.link/9615355.CDJkKcVGEf@rafael.j.wysocki
Since thermal_register_governor() is only called by
thermal_register_governors() which runs before clearing
thermal_class_unavailable, thermal_tz_list is guaranteed to be
empty when it runs, so the code walking that list in it is
effectively dead.
The same observation applies to the code walking thermal_tz_list
in thermal_unregister_governor() which is also called only if
thermal_class_unavailable hasn't been cleared.
Remove the dead code from both functions mentioned above and rearrange
thermal_register_governor() to reduce indentation level.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Link: https://patch.msgid.link/3950489.kQq0lBPeGt@rafael.j.wysocki
