Commit Graph

410 Commits

Author SHA1 Message Date
Linus Torvalds
9792d660a4 Merge tag 'devicetree-for-6.18' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
 "DT core:

   - Update dtc to upstream version v1.7.2-35-g52f07dcca47c

   - Add stub for of_get_next_child_with_prefix()

   - Convert of_msi_map_id() callers to of_msi_xlate()

 DT bindings:

   - Convert multiple text board bindings to DT schema format

   - Add bindings for synaptics,synaptics_i2c touchscreen controller,
     innolux,n133hse-ea1 and nlt,nl12880bc20-spwg-24 displays, and NXP
     vf610 reboot controller

   - Add new Arm Cortex-A320/A520AE/A720AE and C1-Nano/Pro/Premium/Ultra
     CPUs. Add missing Applied Micro CPU compatibles. Add pu-supply and
     fsl,soc-operating-points properties for CPU nodes.

   - Add QCom Glymur PDC and tegra264-agic interrupt controllers

   - Add samsung,exynos8890-mali GPU to Arm Mali Midgard

   - Drop Samsung S3C2410 display related bindings

   - Allow separate DP lane and AUX connections in dp-connector

   - Add some missing, undocumented vendor prefixes

   - Add missing '#address-cells' properties in interrupt controller
     bindings which dtc now warns about

   - Drop duplicate socfpga-sdram-edac.txt, moxa,moxart-watchdog.txt,
     fsl/mpic.txt, ti,opa362.txt, and cavium-thunder2.txt legacy text
     bindings which are already covered by existing schemas.

   - Various binding fixes for Mediatek platforms in mailbox, regulator,
     pinctrl, timer, and display

   - Drop work-around for yamllint quoting of values containing ','

   - Various spelling, typo, grammar, and duplicated words fixes in DT
     bindings and docs

   - Add binding guidelines for defining properties at top level of
     schemas, lack of node name ABI, and usage of simple-mfd"

* tag 'devicetree-for-6.18' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (81 commits)
  dt-bindings: arm: altera: Drop socfpga-sdram-edac.txt
  dt-bindings: gpu: Convert nvidia,gk20a to DT schema
  dt-bindings: rng: sparc_sun_oracle_rng: convert to DT schema
  dt-bindings: vendor-prefixes: update regex for properties without a prefix
  dt-bindings: display: bridge: convert megachips-stdpxxxx-ge-b850v3-fw.txt to yaml
  scripts: dt_to_config: fix grammar and a typo in --help text
  dt-bindings: fix spelling, typos, grammar, duplicated words
  docs: dt: fix grammar and spelling
  of: base: Add of_get_next_child_with_prefix() stub
  dt-bindings: trivial-devices: Add compatible string synaptics,synaptics_i2c
  dt-bindings: soc: mediatek: pwrap: Add power-domains property
  dt-bindings: pinctrl: mt65xx: Allow gpio-line-names
  dt-bindings: media: Convert MediaTek mt8173-vpu bindings to DT schema
  dt-bindings: arm: mediatek: Support mt8183-audiosys variant
  dt-bindings: mailbox: mediatek,gce-mailbox: Make clock-names optional
  dt-bindings: regulator: mediatek,mt6331: Add missing compatible
  dt-bindings: regulator: mediatek,mt6331: Fix various regulator names
  dt-bindings: regulator: mediatek,mt6332-regulator: Add missing compatible
  dt-bindings: pinctrl: mediatek,mt7622-pinctrl: Add missing base reg
  dt-bindings: pinctrl: mediatek,mt7622-pinctrl: Add missing pwm_ch7_2
  ...
2025-10-01 16:58:24 -07:00
Manaf Meethalavalappu Pallikunhi
79428e6089 dt-bindings: thermal: qcom-tsens: Document the Glymur temperature Sensor
Document the Temperature Sensor (TSENS) on Glymur Platform.

Signed-off-by: Manaf Meethalavalappu Pallikunhi <quic_manafm@quicinc.com>
Signed-off-by: Pankaj Patil <pankaj.patil@oss.qualcomm.com>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20250920123631.281153-1-pankaj.patil@oss.qualcomm.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-09-26 13:27:44 +02:00
John Madieu
caf41eb457 dt-bindings: thermal: r9a09g047-tsu: Document the TSU unit
The Renesas RZ/G3E SoC includes a Thermal Sensor Unit (TSU) block designed
to measure the junction temperature. The device provides real-time
temperature measurements for thermal management, utilizing a single
dedicated channel (channel 1) for temperature sensing.

Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: John Madieu <john.madieu.xa@bp.renesas.com>
Link: https://lore.kernel.org/r/20250917170202.197929-2-john.madieu.xa@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-09-25 22:11:00 +02:00
Sebastian Reichel
e881662aa0 dt-bindings: thermal: rockchip: Tighten grf requirements
Instead of having an optional rockchip,grf property, forbid using it on
platforms without registers in a GRF being needed for thermal monitoring
and make it mandatory on the platforms actually needing it.

Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Reviewed-by: Dragan Simic <dsimic@manjaro.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20250820-thermal-rockchip-grf-warning-v2-3-c7e2d35017b8@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-09-25 22:11:00 +02:00
Claudiu Beznea
a3152e5c74 dt-bindings: thermal: r9a08g045-tsu: Document the TSU unit
The Renesas RZ/G3S SoC includes a Thermal Sensor Unit (TSU) block designed
to measure the junction temperature. The temperature is measured using
the RZ/G3S ADC, with a dedicated ADC channel directly connected to the TSU.
Add documentation for it.

Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Claudiu Beznea <claudiu.beznea.uj@bp.renesas.com>
Tested-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20250810122125.792966-2-claudiu.beznea.uj@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-09-25 22:11:00 +02:00
Svyatoslav Ryhel
aa00251548 dt-bindings: thermal: Document Tegra114 SOCTHERM Thermal Management System
Document SOCTHERM Thermal Management System found in the Tegra 4 SoC.

Signed-off-by: Svyatoslav Ryhel <clamor95@gmail.com>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20250828055104.8073-3-clamor95@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-09-25 22:10:59 +02:00
Gaurav Kohli
4ae50c82a5 dt-bindings: thermal: tsens: Add QCS615 compatible
Add compatibility string for the thermal sensors on QCS615 platform.

Acked-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Gaurav Kohli <quic_gkohli@quicinc.com>
Link: https://lore.kernel.org/r/20250624064945.764245-2-quic_gkohli@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-09-25 22:10:59 +02:00
Rob Herring (Arm)
047170ac08 dt-binding: thermal: Convert marvell,armada-ap806-thermal to DT schema
Convert the Marvell Armada AP80x/CP110 thermal binding to schema. It is
a straight forward conversion.

Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/r/20250822225701.766947-1-robh@kernel.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
2025-09-19 12:29:29 -05:00
Rob Herring (Arm)
c72504a22e dt-bindings: thermal: Convert marvell,armada370-thermal to DT schema
Convert the Marvell Armada 3xx/XP thermal binding to schema.

Drop the AP80x and CP110 as they have long been deprecated and have
been replaced by a new binding.

Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/r/20250822225645.766397-1-robh@kernel.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
2025-09-19 12:29:29 -05:00
Aaron Kling
1d264d3a19 dt-bindings: thermal: tegra: Document Tegra210B01
Add the compatible string for Tegra210B01 SOC_THERM

Acked-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Aaron Kling <webgeek1234@gmail.com>
Link: https://lore.kernel.org/r/20250720-t210b01-v2-5-9cb209f1edfc@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-07-21 22:23:39 +02:00
Aleksander Jan Bajkowski
a9302f8fbe dt-bindings: thermal: mediatek: Add fallback compatible string for MT7981 and MT8516
The ‘mediatek,mt7981-thermal’ and ‘mediatek,mt8516-thermal’ strings
aren't definied in the driver. Both should have fallback compatible
strings. This commit fixes this issue.

Fixes: 788494ba09 ("dt-bindings: thermal: convert Mediatek Thermal to the json-schema")
Signed-off-by: Aleksander Jan Bajkowski <olek2@wp.pl>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Rafał Miłecki <rafal@milecki.pl>
Link: https://lore.kernel.org/r/20250712195904.6988-2-olek2@wp.pl
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-07-21 22:13:46 +02:00
Luca Weiss
47f4bef6e7 dt-bindings: thermal: qcom-tsens: document the Milos Temperature Sensor
Document the Temperature Sensor (TSENS) on the Milos SoC.

Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20250713-sm7635-fp6-initial-v2-8-e8f9a789505b@fairphone.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-07-17 10:45:01 +02:00
Nicolas Frattaroli
75b98a2c35 dt-bindings: thermal: rockchip: document otp thermal trim
Several Rockchip SoCs, such as the RK3576, can store calibration trim
data for thermal sensors in OTP cells. This capability should be
documented.

Such a rockchip thermal sensor may reference cell handles that store
both a chip-wide trim for all the sensors, as well as cell handles
for each individual sensor channel pointing to that specific sensor's
trim value.

Additionally, the thermal sensor may optionally reference cells which
store the base in terms of degrees celsius and decicelsius that the trim
is relative to.

Each SoC that implements this appears to have a slightly different
combination of chip-wide trim, base, base fractional part and
per-channel trim, so which ones do which is documented in the bindings.

Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Nicolas Frattaroli <nicolas.frattaroli@collabora.com>
Acked-by: Heiko Stuebner <heiko@sntech.de>
Link: https://lore.kernel.org/r/20250610-rk3576-tsadc-upstream-v6-4-b6e9efbf1015@collabora.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-07-16 22:11:27 +02:00
Nicolas Frattaroli
83f2ef0f1b dt-bindings: rockchip-thermal: Add RK3576 compatible
Add a new compatible for the thermal sensor device on the RK3576 SoC.

Acked-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Nicolas Frattaroli <nicolas.frattaroli@collabora.com>
Acked-by: Heiko Stuebner <heiko@sntech.de>
Link: https://lore.kernel.org/r/20250610-rk3576-tsadc-upstream-v6-2-b6e9efbf1015@collabora.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-07-16 22:11:19 +02:00
Sricharan Ramabadhran
77c6d28192 dt-bindings: thermal: qcom-tsens: Add ipq5018 compatible
IPQ5018 has tsens v1.0 block with 5 sensors of which 4 are in use
and 1 interrupt.

Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Sricharan Ramabadhran <quic_srichara@quicinc.com>
Signed-off-by: George Moussalem <george.moussalem@outlook.com>
Link: https://lore.kernel.org/r/DS7PR19MB88835BD1063C4D5451E14B0E9DCC2@DS7PR19MB8883.namprd19.prod.outlook.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-05-16 12:50:01 +02:00
Christian Marangi
fd55708d58 dt-bindings: thermal: Add support for Airoha EN7581 thermal sensor
Add support for Airoha EN7581 thermal sensor and monitor. This is a
simple sensor for the CPU or SoC Package that provide thermal sensor and
trip point for hot low and critical condition to fire interrupt and
react on the abnormal state.

Signed-off-by: Christian Marangi <ansuelsmth@gmail.com>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20250511185003.3754495-1-ansuelsmth@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-05-16 12:50:01 +02:00
Linus Torvalds
8868485d6b Merge tag 'thermal-6.15-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
 "These are mostly assorted updates of thermal drivers used on ARM
  platforms:

   - Use dev_err_probe() helpers to simplify the init code in the Qoriq
     thermal driver (Frank Li)

   - Power down the Qoriq's TMU at suspend time (Alice Guo)

   - Add ipq5332, ipq5424 compatible to the QCom's tsens thermal driver
     and TSENS enable / calibration support for V2 (Praveenkumar I)

   - Add missing rk3328 mapping entry (Trevor Woerner)

   - Remove duplicate struct declaration from the thermal core header
     file (Xueqin Luo)

   - Disable the monitoring mode during suspend in the LVTS Mediatek
     driver to prevent temperature acquisition glitches (Nícolas F. R.
     A. Prado)

   - Disable Stage 3 thermal threshold in the LVTS Mediatek driver
     because it disables the suspend ability and does not have an
     interrupt handler (Nícolas F. R. A. Prado)

   - Fix low temperature offset interrupt in the LVTS Mediatek driver to
     prevent multiple interrupts from triggering when the system is at
     its normal functionning temperature (Nícolas F. R. A. Prado)

   - Enable interrupts in the LVTS Mediatek driver only on sensors that
     are in use (Nícolas F. R. A. Prado)

   - Add the BCM74110 compatible DT binding and the corresponding code
     to support a chip based on a different process node than previous
     chips (Florian Fainelli)

   - Correct indentation and style in DTS example (Krzysztof Kozlowski)

   - Unify hexadecimal annotatation in the rcar_gen3 driver (Niklas
     Söderlund)

   - Factor out the code logic to read fuses on Gen3 and Gen4 in the
     rcar_gen3 thermal driver (Niklas Söderlund)

   - Drop unused driver data from the QCom's spmi temperature alarm
     driver (Johan Hovold)"

* tag 'thermal-6.15-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
  thermal/drivers/qcom-spmi-temp-alarm: Drop unused driver data
  thermal: rcar_gen3: Reuse logic to read fuses on Gen3 and Gen4
  thermal: rcar_gen3: Use lowercase hex constants
  dt-bindings: thermal: Correct indentation and style in DTS example
  thermal/drivers/brcmstb_thermal: Add support for BCM74110
  dt-bindings: thermal: Update for BCM74110
  thermal/drivers/mediatek/lvts: Only update IRQ enable for valid sensors
  thermal/drivers/mediatek/lvts: Start sensor interrupts disabled
  thermal/drivers/mediatek/lvts: Disable low offset IRQ for minimum threshold
  thermal/drivers/mediatek/lvts: Disable Stage 3 thermal threshold
  thermal/drivers/mediatek/lvts: Disable monitor mode during suspend
  thermal: core: Remove duplicate struct declaration
  thermal/drivers/rockchip: Add missing rk3328 mapping entry
  thermal/drivers/tsens: Add TSENS enable and calibration support for V2
  dt-bindings: thermal: tsens: Add ipq5332, ipq5424 compatible
  thermal/drivers/qoriq: Power down TMU on system suspend
  thermal/drivers/qoriq: Use dev_err_probe() simplify the code
2025-04-01 16:51:44 -07:00
Krzysztof Kozlowski
5ad72c2b24 dt-bindings: thermal: Correct indentation and style in DTS example
DTS example in the bindings should be indented with 2- or 4-spaces and
aligned with opening '- |', so correct any differences like 3-spaces or
mixtures 2- and 4-spaces in one binding.

No functional changes here, but saves some comments during reviews of
new patches built on existing code.

Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Chen-Yu Tsai <wens@csie.org>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20250107131027.246608-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-03-25 20:52:04 +01:00
Florian Fainelli
2395a02809 dt-bindings: thermal: Update for BCM74110
Update the binding with the BCM74110 compatible string which denotes the
first device we need to support in a different process node requiring an
updated thermal equation.

Signed-off-by: Florian Fainelli <florian.fainelli@broadcom.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20250116193842.758788-2-florian.fainelli@broadcom.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-03-25 20:52:04 +01:00
Praveenkumar I
1a685e2b3f dt-bindings: thermal: tsens: Add ipq5332, ipq5424 compatible
The IPQ5332 and IPQ5424 use TSENS v2.3.3 IP with combined interrupt.
RPM is not available in these SoCs, hence adding new compatible
to have the sensor enablement and calibration function. Also add
nvmem-cell-names.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Praveenkumar I <quic_ipkumar@quicinc.com>
Signed-off-by: Manikanta Mylavarapu <quic_mmanikan@quicinc.com>
Link: https://lore.kernel.org/r/20250210120436.821684-2-quic_mmanikan@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2025-03-25 20:52:03 +01:00
Ahmad Fatoum
738b785693 dt-bindings: thermal: give OS some leeway in absence of critical-action
An operating system may allow its user to configure the action to be
undertaken on critical overtemperature events.

However, the bindings currently mandate an absence of the critical-action
property to be equal to critical-action = "shutdown", which would mean any
differing user configuration would violate the bindings.

Resolve this by documenting the absence of the property to mean that the
OS gets to decide.

Link: https://lkml.kernel.org/r/20250217-hw_protection-reboot-v3-10-e1c09b090c0c@pengutronix.de
Signed-off-by: Ahmad Fatoum <a.fatoum@pengutronix.de>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Cc: Benson Leung <bleung@chromium.org>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: Fabio Estevam <festevam@denx.de>
Cc: Guenter Roeck <groeck@chromium.org>
Cc: Jonathan Corbet <corbet@lwn.net>
Cc: Liam Girdwood <lgirdwood@gmail.com>
Cc: Lukasz Luba <lukasz.luba@arm.com>
Cc: Mark Brown <broonie@kernel.org>
Cc: Matteo Croce <teknoraver@meta.com>
Cc: Matti Vaittinen <mazziesaccount@gmail.com>
Cc: "Rafael J. Wysocki" <rafael@kernel.org>
Cc: Rui Zhang <rui.zhang@intel.com>
Cc: Sascha Hauer <kernel@pengutronix.de>
Cc: "Serge E. Hallyn" <serge@hallyn.com>
Cc: Tzung-Bi Shih <tzungbi@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
2025-03-16 23:24:14 -07:00
Rayyan Ansari
fed79caaf7 dt-bindings: thermal: qcom-tsens: Document ipq6018 temperature sensor
Document the ipq6018 temperature sensor, which is used in ipq6018.dtsi
and is compatible with the ipq8074 temperature sensor.

Signed-off-by: Rayyan Ansari <rayyan.ansari@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20240716133803.82907-1-rayyan.ansari@linaro.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
2025-01-07 08:35:34 -06:00
Barnabás Czémán
fd9d75ef46 dt-bindings: thermal: tsens: Add MSM8937
Document the compatible string for tsens v1.4 block found in MSM8937.

Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Barnabás Czémán <barnabas.czeman@mainlining.org>
Link: https://lore.kernel.org/r/20241113-msm8917-v6-4-c348fb599fef@mainlining.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-11-13 16:21:18 +01:00
Dmitry Baryshkov
59e127d58c dt-bindings: thermal: qcom-tsens: Add SAR2130P compatible
Document compatible for thermal sensors on Qualcomm SAR2130P platform.

Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20241027-sar2130p-tsens-v1-1-8dee27fc02ae@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-11-13 16:17:57 +01:00
Linus Torvalds
2a17bb8c20 Merge tag 'devicetree-for-6.12' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
 "DT Bindings:

   - Drop duplicate devices in trivial-devices.yaml

   - Add a common serial peripheral device schema and reference it in
     serial device schemas.

   - Convert nxp,lpc1850-wdt, zii,rave-wdt, ti,davinci-wdt,
     snps,archs-pct, fsl,bcsr, fsl,fpga-qixis-i2c, fsl,fpga-qixis,
     fsl,cpm-enet, fsl,cpm-mdio, fsl,ucc-hdlc, maxim,ds26522,
     aspeed,ast2400-cvic, aspeed,ast2400-vic, fsl,ftm-timer,
     ti,davinci-timer, fsl,rcpm, and qcom,ebi2 to DT schema

   - Add support for rockchip,rk3576-wdt, qcom,apss-wdt-sa8255p,
     fsl,imx8qm-irqsteer, qcom,pm6150-vib, qcom,sa8255p-pdc,
     isil,isl69260, ti,tps546d24, and lpc32xx DMA mux

   - Drop duplicate nvidia,tegra186-ccplex-cluster.yaml and
     mediatek,mt6795-sys-clock.yaml

   - Add arm,gic ESPI and EPPI interrupt type specifiers

   - Add another batch of legacy compatible strings which we have no
     intention of documenting

   - Add dmas/dma-names properties to FSL lcdif

   - Fix wakeup-source reference to m8921-keypad.yaml

   - Treewide fixes of typos in bindings

  DT Core:

   - Update dtc/libfdt to upstream version v1.7.0-95-gbcd02b523429

   - More conversions to scoped iterators and __free() initializer

   - Handle overflows in address resources on 32-bit systems

   - Extend extracting compatible strings in sources from function
     parameters

   - Use of_property_present() in DT unittest

   - Clean-up of_irq_to_resource() to use helpers

   - Support #msi-cells=<0> in of_msi_get_domain()

   - Improve the kerneldoc for of_property_match_string()

   - kselftest: Ignore nodes that have ancestors disabled"

* tag 'devicetree-for-6.12' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (59 commits)
  dt-bindings: watchdog: Add rockchip,rk3576-wdt compatible
  dt-bindings: cpu: Drop duplicate nvidia,tegra186-ccplex-cluster.yaml
  dt-bindings: clock: mediatek: Drop duplicate mediatek,mt6795-sys-clock.yaml
  of/irq: Use helper to define resources
  of/irq: Make use of irq_get_trigger_type()
  dt-bindings: clk: vc5: Make SD/OE pin configuration properties not required
  drivers/of: Improve documentation for match_string
  of: property: Do some clean up with use of __free()
  dt-bindings: watchdog: qcom-wdt: document support on SA8255p
  dt-bindings: interrupt-controller: fsl,irqsteer: Document fsl,imx8qm-irqsteer
  dt-bindings: interrupt-controller: arm,gic: add ESPI and EPPI specifiers
  dt-bindings: dma: Add lpc32xx DMA mux binding
  dt-bindings: trivial-devices: Drop duplicate "maxim,max1237"
  dt-bindings: trivial-devices: Drop duplicate LM75 compatible devices
  dt-bindings: trivial-devices: Deprecate "ad,ad7414"
  dt-bindings: trivial-devices: Drop incorrect and duplicate at24 compatibles
  dt-bindings: wakeup-source: update reference to m8921-keypad.yaml
  dt-bindings: interrupt-controller: qcom-pdc: document support for SA8255p
  dt-bindings: Fix various typos
  of: address: Unify resource bounds overflow checking
  ...
2024-09-19 08:38:51 +02:00
Yu-Chun Lin
a7fcc23274 dt-bindings: Fix various typos
Corrected several typos in Documentation/devicetree/bindings files.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Kuan-Wei Chiu <visitorckw@gmail.com>
Reviewed-by: Matti Vaittinen <mazziesaccount@gmail.com>
Signed-off-by: Yu-Chun Lin <eleanor15x@gmail.com>
Link: https://lore.kernel.org/r/20240905151943.2792056-1-eleanor15x@gmail.com
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
2024-09-13 14:01:34 -05:00
Nikunj Kela
f41e6475ff dt-bindings: thermal: tsens: document support on SA8255p
Add compatible for sensors representing support on SA8255p.

Signed-off-by: Nikunj Kela <quic_nkela@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240828203721.2751904-14-quic_nkela@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-09-02 13:12:54 +02:00
George Stark
77545bdfe4 dt-bindings: thermal: amlogic,thermal: add optional power-domains
On newer SoCs, the thermal hardware can require a power domain to
operate so add corresponding optional property.

Signed-off-by: George Stark <gnstark@salutedevices.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240710223214.2348418-3-gnstark@salutedevices.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-09-02 12:43:20 +02:00
Linus Torvalds
0ffb8a4c96 Merge tag 'devicetree-for-6.11' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
 "DT Bindings:

   - Convert and add a bunch of IBM FSI related bindings

   - Add a new schema listing legacy compatibles which will (probably)
     never be documented. This will silence various checks warning about
     them.

   - Add bindings for Sierra Wireless mangOH Green SPI IoT interface,
     new Arm 2024 Cortex and Neoverse CPUs, QCom sc8180x PDC, QCom SDX75
     GPI DMA, imx8mp/imx8qxp fsl,irqsteer, and Renesas RZ/G2UL CRU and
     CSI-2 blocks

   - Convert Spreadtrum sprd-timer, FSL cpm_qe, FSL fsl,ls-scfg-msi, FSL
     q(b)man-*, FSL qoriq-mc, and img,pdc-wdt bindings to DT schema

   - Drop obsolete stericsson,abx500.txt

  DT core:

   - Update dtc to upstream version v1.7.0-93-g1df7b047fe43

   - Add support to run DT validation on DTs with applied overlays

   - Add helper for creating boolean properties in dynamic nodes and use
     that for dynamic PCI nodes

   - Clean-up early parsing of '#{address,size}-cells'"

* tag 'devicetree-for-6.11' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (39 commits)
  dt-bindings: timer: sprd-timer: convert to YAML
  dt-bindings: incomplete-devices: document devices without bindings
  dt-bindings: trivial-devices: document the Sierra Wireless mangOH Green SPI IoT interface
  scripts/dtc: Update to upstream version v1.7.0-93-g1df7b047fe43
  dt-bindings: soc: fsl: Add fsl,ls1028a-reset for reset syscon node
  dt-bindings: soc: fsl: cpm_qe: convert to yaml format
  dt-bindings: i2c: i2c-fsi: Convert to json-schema
  dt-bindings: fsi: Document the FSI Hub Controller
  dt-bindings: fsi: Document the AST2700 FSI controller
  dt-bindings: fsi: ast2600-fsi-master: Convert to json-schema
  dt-bindings: fsi: ibm,i2cr-fsi-master: Reference common FSI controller
  dt-bindings: fsi: Document the FSI controller common properties
  dt-bindings: fsi: Document the IBM SBEFIFO engine
  dt-bindings: fsi: p9-occ: Convert to json-schema
  dt-bindings: fsi: Document the IBM SCOM engine
  dt-bindings: fsi: fsi2spi: Document SPI controller child nodes
  dt-bindings: interrupt-controller: convert fsl,ls-scfg-msi to yaml
  dt-bindings: soc: fsl: Convert q(b)man-* to yaml format
  dt-bindings: misc: fsl,qoriq-mc: convert to yaml format
  dt-bindings: drop stale Anson Huang from maintainers
  ...
2024-07-17 18:07:31 -07:00
Rob Herring (Arm)
6f48290b1a dt-bindings: thermal: Drop 'trips' node as required
It is possible to have thermal zones which don't have any trip points.
These zones in effect simply represent a temperature sensor without any
action associated with it. While the schema has always required a
'trips' node, users have existed for a long time without it. Update the
schema to match reality.

Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240709150154.3272825-1-robh@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
fd1f85b2e7 dt-bindings: thermal: qoriq: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-12-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
f062dc5cca dt-bindings: thermal: cleanup examples indentation
Preferred indentation for DTS examples in the bindings is 4-space.  It
is also preferred not to have redundant/unused labels. No functional
change

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-22-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
bbb4c17939 dt-bindings: thermal: simplify few bindings
Simplify few bindings which already reference thermal-sensor.yaml schema
by dropping unneeded requiring of '#thermal-sensor-cells' and dropping
assigned-clocks properties (core schema allows it if 'clocks' are
there).

Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-21-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
a985dceccd dt-bindings: thermal: ti,j72xx: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-20-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
323a6134e7 dt-bindings: thermal: ti,am654: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-19-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
17cdc4717d dt-bindings: thermal: st,stm32: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-18-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
f9b2d6b840 dt-bindings: thermal: sprd: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-17-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
28b3175105 dt-bindings: thermal: socionext,uniphier: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-16-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
bf1163bb00 dt-bindings: thermal: rzg2l: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Reviewed-by: Biju Das <biju.das.jz@bp.renesas.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-15-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
9abcf4ac35 dt-bindings: thermal: rockchip: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-14-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
7410853a1d dt-bindings: thermal: rcar-gen3: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-13-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:40 +02:00
Krzysztof Kozlowski
80c3fda5de dt-bindings: thermal: qcom-tsens: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Amit Kucheria <amitk@kernel.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-11-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
c1bca276d8 dt-bindings: thermal: qcom-spmi-adc-tm5: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-10-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
df300226f6 dt-bindings: thermal: qcom-spmi-adc-tm-hc: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-9-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
b760aeec3d dt-bindings: thermal: nvidia,tegra30-tsensor: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-8-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
b6f4d62c53 dt-bindings: thermal: nvidia,tegra186-bpmp: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-7-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
57fa7d6687 dt-bindings: thermal: imx8mm: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-6-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
2410427cc8 dt-bindings: thermal: generic-adc: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-5-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
0ae2a1a614 dt-bindings: thermal: brcm,avs-ro: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Acked-by: Florian Fainelli <florian.fainelli@broadcom.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-4-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00
Krzysztof Kozlowski
e8eca74902 dt-bindings: thermal: allwinner,sun8i-a83t-ths: reference thermal-sensor schema
Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.

Reviewed-by: Vasily Khoruzhick <anarsoul@gmail.com>
Acked-by: Chen-Yu Tsai <wens@csie.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-3-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2024-07-15 13:31:39 +02:00