Commit Graph

2 Commits

Author SHA1 Message Date
Raviteja Laggyshetty
11e15a6f32 dt-bindings: interconnect: qcom: Drop QPIC_CORE IDs
As like other SDX targets, SDX75 QPIC BCM resource is also modeled as a
RPMh clock in clk-rpmh driver. However, for SDX75, this resource was also
described as an interconnect node mistakenly.

Hence, drop the QPIC interconnect IDs and let the clients use clk-rpmh
driver to vote for this resource.

Even though this change is an ABI break, it is necessary to avoid
describing the same resource provider in two different drivers, as it may
lead to votes from clients overriding each other.

Fixes: 956329ec7c ("dt-bindings: interconnect: Add compatibles for SDX75")
Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com>
[mani: kept the QUP defines value unchanged]
Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@oss.qualcomm.com>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20250926-sdx75-icc-v2-2-20d6820e455c@oss.qualcomm.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-10-31 02:48:50 +02:00
Rohit Agarwal
956329ec7c dt-bindings: interconnect: Add compatibles for SDX75
Add dt-bindings compatibles and interconnect IDs for
Qualcomm SDX75 platform.

Signed-off-by: Rohit Agarwal <quic_rohiagar@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/1694614256-24109-2-git-send-email-quic_rohiagar@quicinc.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-10-10 12:14:51 +03:00